EPM570F256C5NRR vs EPM570F256C3N Сравнение
Подробное сравнение бок о бок EPM570F256C5NRR от Intel и EPM570F256C3N от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Сравнение характеристик
| Параметр | EPM570F256C5NRR | EPM570F256C3N |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Активен | Активен |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $10,90 | $13,75 |
| Series | MAX II | — |
| Family | MAX II (CPLD) | MAX II |
| Logic Elements | 570 | — |
| Macro Cells | 440 | — |
| Pin-to-Pin Delay (tPD) | 8.7 ns (C5 speed grade) | — |
| Internal fMAX | 201.1 MHz | — |
| User Flash Memory (UFM) | 8 Kbytes | 8 Kbits |
| Maximum User I/O Pins | 212 (typical, 256-BGA) | — |
| Operating Supply Voltage - Core (VCCINT) | 2.5 V (3.3 V tolerant) | — |
| Operating Supply Voltage - I/O (VCCIO) | 2.5 V or 3.3 V | — |
| Process Technology | 0.18 µm flash CMOS | 0.18 um, 6-layer-metal flash CMOS |
| Корпус | 256-ball FBGA (FineLine BGA) | 256-ball FBGA (FineLine BGA) |
| Тип монтажа | Surface Mount | Surface Mount |
| Рабочая температура | 0 °C to +85 °C (commercial, C-speed grade) | — |
| Programming Interface | JTAG (IEEE 1149.1), in-system programmable | JTAG (IEEE 1532 / IEEE 1149.1) + ISP |
| Configuration Memory | On-chip non-volatile flash | — |
| Статус RoHS | Compliant | Compliant (per DigiKey listing) |
| Logic Elements (LEs) | — | 570 |
| Equivalent Macrocells | — | 440 |
| Maximum Operating Frequency | — | 304 MHz |
| Core Voltage | — | 2.5 V / 3.3 V |
| I/O Voltage Support (MultiVolt) | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| User I/O Count | — | [DATA_NEEDED: confirm exact user-IO count for F256 package] |
| Operating Temperature (C3 grade) | — | 0 C to +85 C (commercial) |
| Уровень MSL | — | [DATA_NEEDED: MSL level not stated in provided data] |
| Lead-Free | — | Yes (per suffix 'N' convention) |
| Typical Macroscopic Functions | — | Glue logic, bus bridging, I/O expansion, power sequencing |