EPM570F256I5N vs EPM570F256C3N Vergleich

Detaillierter Direktvergleich von EPM570F256I5N von Intel und EPM570F256C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EPM570F256I5N EPM570F256C3N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $19,85 $13,75
Family MAX II MAX II
Logic Elements 570 —
Macrocells 440 —
User I/O Count 160 [DATA_NEEDED: confirm exact user-IO count for F256 package]
User Flash Memory 8 kbits (9220 bits) —
Pin-to-Pin Delay (tPD1) 5.4 ns —
Maximum Internal Frequency 304 MHz —
Global Clock Networks 4 —
Global Clear/Reset Signals 2 —
Core Voltage (VCCINT) 1.8 V —
I/O Voltage (VCCIO) 1.5 V / 1.8 V / 2.5 V / 3.3 V (multiVolt) —
Gehäuse 256-ball FineLine BGA (17 mm x 17 mm) 256-ball FBGA (FineLine BGA)
Montageart Surface Mount Surface Mount
Betriebstemperatur -40C to +100C (TJ, industrial) —
Programming Interface JTAG (IEEE 1149.1) / ISP (IEEE 1532) JTAG (IEEE 1532 / IEEE 1149.1) + ISP
Configuration Memory Internal Flash (non-volatile, instant-on) —
RoHS-Status Compliant (N suffix = Pb-free) Compliant (per DigiKey listing)
Logic Elements (LEs) — 570
Equivalent Macrocells — 440
User Flash Memory (UFM) — 8 Kbits
Maximum Operating Frequency — 304 MHz
Process Technology — 0.18 um, 6-layer-metal flash CMOS
Core Voltage — 2.5 V / 3.3 V
I/O Voltage Support (MultiVolt) — 1.5 V, 1.8 V, 2.5 V, 3.3 V
Operating Temperature (C3 grade) — 0 C to +85 C (commercial)
MSL-Level — [DATA_NEEDED: MSL level not stated in provided data]
Lead-Free — Yes (per suffix 'N' convention)
Typical Macroscopic Functions — Glue logic, bus bridging, I/O expansion, power sequencing

Datenblätter & Ressourcen

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