EPM570F256I5N vs EPM570F256C3N Сравнение
Подробное сравнение бок о бок EPM570F256I5N от Intel и EPM570F256C3N от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Сравнение характеристик
| Параметр | EPM570F256I5N | EPM570F256C3N |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Активен | Активен |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $19,85 | $13,75 |
| Family | MAX II | MAX II |
| Logic Elements | 570 | — |
| Macrocells | 440 | — |
| User I/O Count | 160 | [DATA_NEEDED: confirm exact user-IO count for F256 package] |
| User Flash Memory | 8 kbits (9220 bits) | — |
| Pin-to-Pin Delay (tPD1) | 5.4 ns | — |
| Maximum Internal Frequency | 304 MHz | — |
| Global Clock Networks | 4 | — |
| Global Clear/Reset Signals | 2 | — |
| Core Voltage (VCCINT) | 1.8 V | — |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multiVolt) | — |
| Корпус | 256-ball FineLine BGA (17 mm x 17 mm) | 256-ball FBGA (FineLine BGA) |
| Тип монтажа | Surface Mount | Surface Mount |
| Рабочая температура | -40C to +100C (TJ, industrial) | — |
| Programming Interface | JTAG (IEEE 1149.1) / ISP (IEEE 1532) | JTAG (IEEE 1532 / IEEE 1149.1) + ISP |
| Configuration Memory | Internal Flash (non-volatile, instant-on) | — |
| Статус RoHS | Compliant (N suffix = Pb-free) | Compliant (per DigiKey listing) |
| Logic Elements (LEs) | — | 570 |
| Equivalent Macrocells | — | 440 |
| User Flash Memory (UFM) | — | 8 Kbits |
| Maximum Operating Frequency | — | 304 MHz |
| Process Technology | — | 0.18 um, 6-layer-metal flash CMOS |
| Core Voltage | — | 2.5 V / 3.3 V |
| I/O Voltage Support (MultiVolt) | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| Operating Temperature (C3 grade) | — | 0 C to +85 C (commercial) |
| Уровень MSL | — | [DATA_NEEDED: MSL level not stated in provided data] |
| Lead-Free | — | Yes (per suffix 'N' convention) |
| Typical Macroscopic Functions | — | Glue logic, bus bridging, I/O expansion, power sequencing |