EPM570GF256C5 vs EPM570GF256C4 Vergleich
Detaillierter Direktvergleich von EPM570GF256C5 von Intel und EPM570GF256C4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPM570GF256C5 | EPM570GF256C4 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $18,95 | $29,85 |
| Family | MAX II | MAX II |
| Logic Elements (LE) | 570 | — |
| Macrocells | 440 | 440 |
| Maximum User I/Os | 76 | 212 |
| User Flash Memory (UFM) | 8 Kbits | — |
| Pin-to-Pin Logic Delay | 5.4 ns (tPD1, -5 speed grade) | — |
| Maximum Operating Frequency | 201.1 MHz (fCNT, internal) | — |
| Supply Voltage - Core | 1.8 V (internal LDO) | — |
| Supply Voltage - I/O (VCCIO) | 3.3 V / 2.5 V / 1.8 V (MultiVolt) | — |
| Betriebstemperatur | -40 C to +125 C | 0 °C to +85 °C (commercial) |
| Gehäuse | 256-ball FineLine BGA, 11 x 11 mm, 1.0 mm pitch | 256-ball FBGA (FineLine BGA) |
| Process Technology | 0.18 micron flash CMOS | 0.18 µm CMOS, flash-based configuration |
| Configuration | Non-volatile flash, instant-on (ISP) | — |
| Program Memory Type | Flash (internal) | — |
| JTAG Support | Yes (IEEE 1149.1) | IEEE 1149.1 boundary-scan + ISP |
| RoHS-Status | Compliant (lead-free FBGA) | Lead-free, RoHS compliant |
| Logic Family | CMOS | — |
| Logic Elements (LEs) | — | 570 |
| Pin-to-Pin Delay (tPD) | — | 5.4 ns |
| Supply Voltage VCCINT | — | 1.71 V to 1.89 V (core, derived from 2.5/3.3 V) |
| I/O Bank Voltage VCCIO | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage LVCMOS/LVTTL) |
| Ball Pitch | — | 1.0 mm |
| Montageart | — | Surface Mount |
| Configuration Memory | — | Non-volatile flash (instant-on, no boot PROM) |