EPM570GF256C5 vs EPM570GF256C4 Comparación
Comparación detallada lado a lado de EPM570GF256C5 por Intel y EPM570GF256C4 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM570GF256C5 | EPM570GF256C4 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $18,95 | $29,85 |
| Family | MAX II | MAX II |
| Logic Elements (LE) | 570 | — |
| Macrocells | 440 | 440 |
| Maximum User I/Os | 76 | 212 |
| User Flash Memory (UFM) | 8 Kbits | — |
| Pin-to-Pin Logic Delay | 5.4 ns (tPD1, -5 speed grade) | — |
| Maximum Operating Frequency | 201.1 MHz (fCNT, internal) | — |
| Supply Voltage - Core | 1.8 V (internal LDO) | — |
| Supply Voltage - I/O (VCCIO) | 3.3 V / 2.5 V / 1.8 V (MultiVolt) | — |
| Temperatura de funcionamiento | -40 C to +125 C | 0 °C to +85 °C (commercial) |
| Encapsulado | 256-ball FineLine BGA, 11 x 11 mm, 1.0 mm pitch | 256-ball FBGA (FineLine BGA) |
| Process Technology | 0.18 micron flash CMOS | 0.18 µm CMOS, flash-based configuration |
| Configuration | Non-volatile flash, instant-on (ISP) | — |
| Program Memory Type | Flash (internal) | — |
| JTAG Support | Yes (IEEE 1149.1) | IEEE 1149.1 boundary-scan + ISP |
| Estado RoHS | Compliant (lead-free FBGA) | Lead-free, RoHS compliant |
| Logic Family | CMOS | — |
| Logic Elements (LEs) | — | 570 |
| Pin-to-Pin Delay (tPD) | — | 5.4 ns |
| Supply Voltage VCCINT | — | 1.71 V to 1.89 V (core, derived from 2.5/3.3 V) |
| I/O Bank Voltage VCCIO | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage LVCMOS/LVTTL) |
| Ball Pitch | — | 1.0 mm |
| Tipo de montaje | — | Surface Mount |
| Configuration Memory | — | Non-volatile flash (instant-on, no boot PROM) |