EPM570GT144C3N vs EPM570GT144C3 Vergleich
Detaillierter Direktvergleich von EPM570GT144C3N von Intel und EPM570GT144C3 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EPM570GT144C3N | EPM570GT144C3 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $28,95 | $13,50 |
| Family | MAX II | MAX II |
| Logic Elements (LEs) | 570 | 570 |
| Equivalent Macrocells | 440 | 440 |
| User I/Os | 116 | — |
| Pin-to-Pin Logic Delay (tPD1) | 5.4 ns | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits (8,192 bits) |
| Internal Supply Voltage | 1.71 V to 1.89 V | — |
| I/O Standards Supported | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS/LVTTL | — |
| Programmable Type | In System Programmable (Flash) | — |
| Programming Interface | JTAG (IEEE 1149.1) | JTAG IEEE 1149.1 (ISP) |
| Gehäuse | 144-pin TQFP (20 x 20 mm) | 144-pin TQFP (GT144) |
| Betriebstemperatur | 0 C to +85 C (Commercial) | 0 °C to +85 °C (commercial, C3 grade) |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Process Technology | 6-layer-metal flash CMOS | 0.30 µm 6-layer-metal flash CMOS |
| User I/O Count | — | 76 (max, package-dependent) |
| Pin-to-Pin Propagation Delay (tPD1) | — | 5.4 ns (commercial, fastest speed grade) |
| Core Supply Voltage | — | 1.8 V (internal regulator from VCCINT 3.3 V) |
| I/O Supply Voltages | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Configuration Method | — | Non-volatile on-chip flash (instant-on) |
| MSL-Level | — | MSL 3 (per JEDEC J-STD-020) |