EPM570GT144C3N vs EPM570GT144C3 Comparación
Comparación detallada lado a lado de EPM570GT144C3N por Intel y EPM570GT144C3 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM570GT144C3N | EPM570GT144C3 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $28,95 | $13,50 |
| Family | MAX II | MAX II |
| Logic Elements (LEs) | 570 | 570 |
| Equivalent Macrocells | 440 | 440 |
| User I/Os | 116 | — |
| Pin-to-Pin Logic Delay (tPD1) | 5.4 ns | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits (8,192 bits) |
| Internal Supply Voltage | 1.71 V to 1.89 V | — |
| I/O Standards Supported | 1.5 V / 1.8 V / 2.5 V / 3.3 V LVCMOS/LVTTL | — |
| Programmable Type | In System Programmable (Flash) | — |
| Programming Interface | JTAG (IEEE 1149.1) | JTAG IEEE 1149.1 (ISP) |
| Encapsulado | 144-pin TQFP (20 x 20 mm) | 144-pin TQFP (GT144) |
| Temperatura de funcionamiento | 0 C to +85 C (Commercial) | 0 °C to +85 °C (commercial, C3 grade) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | Compliant |
| Process Technology | 6-layer-metal flash CMOS | 0.30 µm 6-layer-metal flash CMOS |
| User I/O Count | — | 76 (max, package-dependent) |
| Pin-to-Pin Propagation Delay (tPD1) | — | 5.4 ns (commercial, fastest speed grade) |
| Core Supply Voltage | — | 1.8 V (internal regulator from VCCINT 3.3 V) |
| I/O Supply Voltages | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Configuration Method | — | Non-volatile on-chip flash (instant-on) |
| Nivel MSL | — | MSL 3 (per JEDEC J-STD-020) |