H5AN4G8NBJR-UHCR vs H5AN4G8NBJR-UHI Vergleich
Detaillierter Direktvergleich von H5AN4G8NBJR-UHCR von SK hynix und H5AN4G8NBJR-UHI von SK hynix. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | H5AN4G8NBJR-UHCR | H5AN4G8NBJR-UHI |
|---|---|---|
| Marke | SK hynix | SK hynix |
| Kategorie | Memory ICs | Memory ICs |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3,18 | $2,25 |
| Speichertyp | DDR4 SDRAM | DDR4 SDRAM |
| Density | 4 Gbit | 4 Gbit |
| Speicherorganisation | 512M x 8 | 512M x 8 |
| Speed Grade | UH (DDR4-2400 class, PC2400) | DDR4-2400 (PC4-19200) |
| Versorgungsspannung | 1.2 V (VDD) | — |
| Schnittstelle | DDR4 SSTL12 | JEDEC DDR4 SDRAM |
| Internal Prefetch | 8n | — |
| Gehäuse | 78-ball FBGA (11 mm x 7.5 mm) | FBGA-78 (78-ball fine-pitch BGA) |
| Montageart | Surface Mount (BGA solder-down) | Surface Mount |
| Operating Case Temperature | -40C to +85C (industrial range) | — |
| Extended Temperature Range | Up to +95C case temperature (per datasheet conditions) | — |
| Lead Free | Yes | — |
| Halogenfrei | Yes | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Packaging Suffix | -R = Tape and Reel | — |
| Refresh | [DATA_NEEDED: refresh rate 1x/2x specification] | Self-refresh and auto-refresh support |
| CAS-Latenz | [DATA_NEEDED: CL value for UH grade] | [DATA_NEEDED: CAS latency at DDR4-2400] |
| Supply Voltage (VDD) | — | 1.2 V |
| Grade | — | Industrial (-UHI suffix) |
| Datenrate | — | 2400 MT/s |
| Bank Architecture | — | DDR4 bank group architecture |
| Termination | — | On-die termination (ODT) |
| Betriebstemperatur | — | [DATA_NEEDED: operating temperature range] |
| MSL-Level | — | [DATA_NEEDED: moisture sensitivity level] |