H5AN4G8NBJR-UHI vs H5AN4G8NBJR-PBC Vergleich
Detaillierter Direktvergleich von H5AN4G8NBJR-UHI von SK hynix und H5AN4G8NBJR-PBC von SK hynix. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | H5AN4G8NBJR-UHI | H5AN4G8NBJR-PBC |
|---|---|---|
| Marke | SK hynix | SK hynix |
| Kategorie | Memory ICs | Memory ICs |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2,25 | $2,20 |
| Speichertyp | DDR4 SDRAM | DDR4 SDRAM |
| Density | 4 Gbit | — |
| Speicherorganisation | 512M x 8 | 512M x 8 |
| Speed Grade | DDR4-2400 (PC4-19200) | PBC |
| Supply Voltage (VDD) | 1.2 V | — |
| Gehäuse | FBGA-78 (78-ball fine-pitch BGA) | 78-ball FBGA |
| Montageart | Surface Mount | Surface Mount |
| Grade | Industrial (-UHI suffix) | — |
| Datenrate | 2400 MT/s | — |
| Schnittstelle | JEDEC DDR4 SDRAM | — |
| Bank Architecture | DDR4 bank group architecture | — |
| Refresh | Self-refresh and auto-refresh support | 8n prefetch, standard/auto refresh per DDR4 JEDEC |
| Termination | On-die termination (ODT) | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | — |
| CAS-Latenz | [DATA_NEEDED: CAS latency at DDR4-2400] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | — |
| MSL-Level | [DATA_NEEDED: moisture sensitivity level] | — |
| Memory Density | — | 4 Gbit |
| Schnittstellentyp | — | Parallel, JEDEC DDR4 |
| Supply Voltage VDD | — | 1.2 V |
| Supply Voltage VDDQ | — | 1.2 V |
| Clock Frequency | — | [DATA_NEEDED: Clock Frequency] |
| CAS Latency (CL) | — | [DATA_NEEDED: CAS Latency] |
| Normal Operating Case Temperature | — | 0C to 85C |
| Extended Temperature Range | — | up to 95C case (with increased refresh) |
| Lead Free | — | Yes |
| Halogenfrei | — | Yes |