H5ANAG6NCR-UHC vs H5ANAG6NAMR-UHC Vergleich
Detaillierter Direktvergleich von H5ANAG6NCR-UHC von SK hynix und H5ANAG6NAMR-UHC von SK hynix. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | H5ANAG6NCR-UHC | H5ANAG6NAMR-UHC |
|---|---|---|
| Marke | SK hynix | SK hynix |
| Kategorie | Mobile LPDDR4 | Memory ICs |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $9,20 | $4,50 |
| Speichertyp | DDR4 SDRAM | DDR4 SDRAM |
| Memory Density | 16 Gb (2 GB) | 16 Gbit (2 GB) |
| Speicherorganisation | 1G x 16 | 1G x 16 |
| Schnittstelle | CMOS, Double Data Rate IV | — |
| Gehäuse | FBGA-96 (PBGA-96) | FBGA-96 (PBGA96) |
| Die Revision | C | — |
| Speed Grade | [DATA_NEEDED: Speed grade / data rate] | — |
| Supply Voltage (VDD) | [DATA_NEEDED: VDD voltage] | 1.2 V |
| Betriebstemperatur | [DATA_NEEDED: Operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Configuration | 1 Channel, 1 Rank | — |
| Refresh | [DATA_NEEDED: Refresh scheme] | Self-refresh and auto-refresh (DDR4 standard 64 ms) |
| Montageart | Surface Mount | Surface Mount (BGA solder ball) |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Factory Packing Quantity | [DATA_NEEDED: Standard packing quantity] | — |
| Application | Main memory, embedded computing, industrial controllers | — |
| Speed Grade / Data Rate | — | DDR4-2400 (UHC bin, PC4-19200) |
| Architecture | — | CMOS DDR4 with bank groups |
| Power Class | — | Normal Power |
| CAS-Latenz | — | [DATA_NEEDED: CL for UHC bin] |
| Schnittstellentyp | — | Parallel, synchronous, double data rate |
| Available Speed Bins (family) | — | PB / RD / TF / UH / VK |
| Application Class | — | Main memory, embedded, industrial |
| Lebenszyklusstatus | — | Active production |