H5ANAG6NCR-UHC vs H5ANAG6NAMR-UHC Comparaison
Comparaison détaillée côte à côte de H5ANAG6NCR-UHC par SK hynix et H5ANAG6NAMR-UHC par SK hynix. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | H5ANAG6NCR-UHC | H5ANAG6NAMR-UHC |
|---|---|---|
| Marque | SK hynix | SK hynix |
| Catégorie | Mobile LPDDR4 | Memory ICs |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $9,20 | $4,50 |
| Type de mémoire | DDR4 SDRAM | DDR4 SDRAM |
| Memory Density | 16 Gb (2 GB) | 16 Gbit (2 GB) |
| Organisation de la mémoire | 1G x 16 | 1G x 16 |
| Interface | CMOS, Double Data Rate IV | — |
| Boîtier | FBGA-96 (PBGA-96) | FBGA-96 (PBGA96) |
| Die Revision | C | — |
| Speed Grade | [DATA_NEEDED: Speed grade / data rate] | — |
| Supply Voltage (VDD) | [DATA_NEEDED: VDD voltage] | 1.2 V |
| Température de fonctionnement | [DATA_NEEDED: Operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Configuration | 1 Channel, 1 Rank | — |
| Refresh | [DATA_NEEDED: Refresh scheme] | Self-refresh and auto-refresh (DDR4 standard 64 ms) |
| Type de montage | Surface Mount | Surface Mount (BGA solder ball) |
| Statut RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Factory Packing Quantity | [DATA_NEEDED: Standard packing quantity] | — |
| Application | Main memory, embedded computing, industrial controllers | — |
| Speed Grade / Data Rate | — | DDR4-2400 (UHC bin, PC4-19200) |
| Architecture | — | CMOS DDR4 with bank groups |
| Power Class | — | Normal Power |
| Latence CAS | — | [DATA_NEEDED: CL for UHC bin] |
| Type d'interface | — | Parallel, synchronous, double data rate |
| Available Speed Bins (family) | — | PB / RD / TF / UH / VK |
| Application Class | — | Main memory, embedded, industrial |
| Statut du cycle de vie | — | Active production |