H5CG24AGBDX022 vs H5CG34MEBDX030 Vergleich

Detaillierter Direktvergleich von H5CG24AGBDX022 von SK hynix und H5CG34MEBDX030 von SK hynix. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

SK hynix
H5CG24AGBDX022 H5CG24AGBDX022 - DDR5 SDRAM Component | SK hynix

H5CG24AGBDX022 - DDR5 SDRAM Component | SK hynix

H5CG24AGBDX022 ✓ Aktiv
SK hynix
H5CG34MEBDX030 H5CG34MEBDX030 - DDR5 SDRAM DRAM Chip | SK hynix

H5CG34MEBDX030 - DDR5 SDRAM DRAM Chip | SK hynix

H5CG34MEBDX030 ✓ Aktiv

Spezifikationsvergleich

Parameter H5CG24AGBDX022 H5CG34MEBDX030
Marke SK hynix SK hynix
Kategorie Memory ICs DRAM
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $5,75
Speichertyp DDR5 SDRAM DDR5 SDRAM
Manufacturer Series H5CG Series (SK hynix DDR5) —
Supply Voltage VDD 1.1 V (DDR5 nominal, per SK hynix DDR5 family) [DATA_NEEDED: VDD (typ. 1.1 V class for DDR5)]
Speicherorganisation [DATA_NEEDED: die organization (x8/x16)] [DATA_NEEDED: x organization]
Density [DATA_NEEDED: die density (Gb)] [DATA_NEEDED: device density (Gb)]
Speed Grade [DATA_NEEDED: DDR5 speed bin (Mbps)] —
Datenrate [DATA_NEEDED: data transfer rate] —
CAS-Latenz [DATA_NEEDED: CL at rated speed bin] —
Bank Count 32 banks / 8 bank groups (DDR5 architecture) —
Burst Length 16 (BL16, DDR5 standard) 16 (DDR5 standard)
ECC On-die ECC (DDR5 standard feature) —
Package Type [DATA_NEEDED: FBGA ball count / package code] —
Betriebstemperatur [DATA_NEEDED: commercial/industrial range] [DATA_NEEDED: operating temperature range]
Schnittstellentyp DDR5 (DFE-based receiver) Parallel, DDR5 point-to-point
RoHS-Status [DATA_NEEDED: RoHS compliance statement] Compliant
Montageart Surface Mount (BGA) Surface Mount
JEDEC Standard DDR5 SDRAM JEDEC standard compatible —
Manufacturer — SK hynix
Product Family — H5CG (DDR5 SDRAM)
Speed Grade / Data Rate — [DATA_NEEDED: MT/s speed bin]
CAS Latency (CL) — [DATA_NEEDED: CL value]
Gehäuse — FBGA (fine-pitch BGA), surface mount
On-die ECC — Yes (DDR5 standard feature)
Bank Groups — [DATA_NEEDED: bank group count]
MSL-Level — [DATA_NEEDED: moisture sensitivity level]

Datenblätter & Ressourcen

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