IRF1310NSTRLPBF vs IPTC039N15NM5ATMA1 Vergleich
Detaillierter Direktvergleich von IRF1310NSTRLPBF von Infineon und IPTC039N15NM5ATMA1 von Infineon. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Infineon
IPTC039N15NM5ATMA1 - 150V 190A OptiMOS 5 N-Channel MOSFET | Infineon
IPTC039N15NM5ATMA1 ✓ AktivSpezifikationsvergleich
| Parameter | IRF1310NSTRLPBF | IPTC039N15NM5ATMA1 |
|---|---|---|
| Marke | Infineon | Infineon |
| Kategorie | MOSFETs | MOSFETs |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,84 | $4,05 |
| Transistortyp | N-Channel MOSFET | N-Channel MOSFET |
| Drain-Source Voltage (VDS) | 100 V | 150 V |
| Continuous Drain Current (ID) at TC=25C | 42 A | — |
| Pulsed Drain Current (IDM) | [DATA_NEEDED: pulsed drain current] | — |
| On-Resistance RDS(on) max at VGS=10V | 36 mOhm | — |
| Gate-Source Voltage (VGS) max | [DATA_NEEDED: VGS max rating] | — |
| Gate Threshold Voltage (VGS(th)) | [DATA_NEEDED: VGS(th) typical] | — |
| Total Gate Charge (Qg) | 73.3 nC | — |
| Power Dissipation (PD) at TC=25C | 160 W | — |
| Power Dissipation (PD) at TA=25C | 3.8 W | — |
| Betriebstemperaturbereich | -55C to +175C | — |
| Gehäuse | D2PAK (TO-263AB) | PG-HDSOP-16-2 (top-side cooled) |
| Montageart | Surface Mount | Surface Mount |
| Technology | IR MOSFET (HEXFET) | OptiMOS 5 trench |
| Built-in Diode | Yes (intrinsic body diode) | — |
| Lead-Free / RoHS | Yes (PBF suffix) | — |
| Configuration | Single with built-in diode | — |
| Manufacturer | — | Infineon Technologies |
| Series | — | OptiMOS 5 |
| Continuous Drain Current (ID) at Ta | — | 21 A |
| Continuous Drain Current (ID) at Tc | — | 190 A |
| Power Dissipation (PD) at Ta | — | 3.8 W |
| Power Dissipation (PD) at Tc | — | 319 W |
| On-Resistance RDS(on) typical | — | 3.9 mOhm |
| Gate Charge Qg typical | — | 74 nC |
| Maximum Gate-Source Voltage (VGS) | — | 20 V |
| Betriebstemperatur | — | -55 C to +175 C (junction) |
| Cooling | — | Top-side cooled (case above PCB) |
| RoHS-Status | — | Compliant |