IRFR220NTRPBF vs IRFR220NTRLPBF Vergleich
Detaillierter Direktvergleich von IRFR220NTRPBF von Infineon und IRFR220NTRLPBF von Infineon. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | IRFR220NTRPBF | IRFR220NTRLPBF |
|---|---|---|
| Marke | Infineon | Infineon |
| Kategorie | MOSFETs | MOSFETs |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,22 | $0,22 |
| FET Type | N-Channel MOSFET | — |
| Technology | HEXFET (IR MOSFET) | — |
| Drain-to-Source Voltage (VDS) | 200 V | — |
| Continuous Drain Current (ID) at TC=25°C | 5 A | — |
| Pulsed Drain Current (IDM) | [DATA_NEEDED: pulsed drain current] | — |
| Gate-to-Source Voltage (VGS) max | [DATA_NEEDED: VGS max rating] | — |
| Gate Threshold Voltage (VGS(th)) | [DATA_NEEDED: VGS(th) typical] | [DATA_NEEDED: VGS(th)] |
| On-Resistance Rds(on) max at VGS=10V | 600 milliohm | — |
| Total Gate Charge (Qg) | 15 nC (typical per Mouser listing) | [DATA_NEEDED: total gate charge Qg] |
| Maximum Power Dissition (PD) at TC=25°C | 43 W | — |
| Betriebs-Sperrschichttemperatur | -55°C to +150°C | — |
| Gehäuse | TO-252AA (DPAK), surface mount | TO-252AA (DPAK), 2 Leads + Tab, SC-63 |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | 1 (unlimited floor life per JEDEC J-STD-020) | 1 |
| RoHS-Status | Compliant (PBF suffix) | Compliant (Pb-free PBF suffix) |
| Avalanche Energy Rated | Yes (fully characterized) | — |
| Lead-Free | Yes (PBF suffix indicates Pb-free plating) | — |
| Polarity | — | N-Channel |
| Mode | — | Enhancement |
| V(BR)DSS (Drain-Source Breakdown Voltage) | — | 200 V |
| Continuous Drain Current (Id) at Tc=25C | — | 5 A |
| Pulsed Drain Current (Idm) | — | [DATA_NEEDED: pulsed drain current] |
| Static Drain-Source On-Resistance (RDS(on)) | — | 0.800 ohm (max) |
| Gate-to-Drain Charge (Qgd) | — | Low (per datasheet - HEXFET design) |
| Power Dissipation (Pd) at Tc=25C | — | 43 W |
| Betriebstemperaturbereich | — | -55C to +150C (junction) |
| Packaging | — | Tape & Reel (Left orientation - TRLPBF) |
| Avalanche Rated | — | Yes (HEXFET ruggedized design) |
| Technology Family | — | HEXFET, Planar, Generation 3 |