IRLR9343TRPBF vs IRFR5505TRPBF Vergleich

Detaillierter Direktvergleich von IRLR9343TRPBF von Infineon und IRFR5505TRPBF von Infineon. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter IRLR9343TRPBF IRFR5505TRPBF
Marke Infineon Infineon
Kategorie MOSFETs MOSFETs
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,47 $0,48
Manufacturer Infineon Technologies (formerly International Rectifier) Infineon Technologies (formerly International Rectifier)
Part Number IRLR9343TRPBF —
FET Type P-Channel MOSFET —
Technology IR HEXFET IR MOSFET (HEXFET 5th generation)
Drain-Source Voltage (VDS) -55 V —
Continuous Drain Current (ID) at Tc=25C -20 A —
Pulsed Drain Current (IDM) [DATA_NEEDED: pulsed drain current rating] -72 A
On-Resistance RDS(on) max at VGS=-10V 105 mOhm 110 mOhm
Gate-Source Voltage (VGS) max [DATA_NEEDED: max VGS rating] +/-20 V
Gate Threshold Voltage (VGS(th)) [DATA_NEEDED: VGS(th) typical/min/max] —
Total Gate Charge (Qg) 31 nC (typical) 21.3 nC
Power Dissipation (PD) at Tc=25C 79 W —
Gehäuse PG-TO252-3 (DPAK) Surface Mount TO-252AA (DPAK), surface mount
Montageart Surface Mount Surface Mount
Betriebstemperaturbereich [DATA_NEEDED: Tj min/max operating range] —
RoHS-Status Compliant Compliant (PBF suffix)
Lead-Free Yes Yes (PBF suffix)
MSL-Level 1 —
Optimized Application Class-D audio amplifier output stages —
Polarity P-Channel P-Channel
Series — HEXFET
Drain-Source Voltage (VDS) max — -55 V
Continuous Drain Current (ID) at TC=25C — -18 A
Gate-Source Charge (Qgs) — [DATA_NEEDED: Qgs]
Gate-Drain Charge (Qgd) — [DATA_NEEDED: Qgd]
Input Capacitance (Ciss) — [DATA_NEEDED: Ciss]
Output Capacitance (Coss) — [DATA_NEEDED: Coss]
Rise Time (tr) — [DATA_NEEDED: tr]
Fall Time (tf) — [DATA_NEEDED: tf]
Maximum Power Dissipation (PD) at TC=25C — 57 W
Betriebs-Sperrschichttemperatur — -55 C to +175 C
Thermal Resistance Junction-to-Case (RthJC) — 2.2 C/W
Thermal Resistance Junction-to-Ambient (RthJA) — 50 C/W (typical, DPAK on 1 oz copper)

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