KMPC8315ECVRAGDA vs MPC8315ECVRAGDA Vergleich
Detaillierter Direktvergleich von KMPC8315ECVRAGDA von NXP Semiconductors und MPC8315ECVRAGDA von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
KMPC8315ECVRAGDA - 400MHz e300c3 MPU | NXP | Networking
KMPC8315ECVRAGDA ObsoleteNXP Semiconductors
MPC8315ECVRAGDA - PowerQUICC II Pro SoC, 400MHz, 620-HBGA | NXP
MPC8315ECVRAGDA ✗ AbgekündigtSpezifikationsvergleich
| Parameter | KMPC8315ECVRAGDA | MPC8315ECVRAGDA |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $42,50 | $20,55 |
| Core Processor | PowerPC e300c3 | — |
| Number of Cores | 1 | — |
| Bus Width | 32-Bit | — |
| Core Frequency | 400 MHz | — |
| Series | MPC83xx (PowerQUICC II Pro) | MPC83xx PowerQUICC II Pro |
| Co-Processor / DSP | Security; SEC 3.3 | — |
| RAM Controllers | DDR, DDR2 | — |
| Graphics Acceleration | No | — |
| Ethernet | 10/100/1000 Mbps MACs | 2x 10/100/1000 MAC (GMII/RGMII) |
| Gehäuse / Bauform | 620-BBGA Exposed Pad, 29x29 mm | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| RoHS-Status | ROHS3 Compliant | — |
| Supply Voltage (Core) | 1 V | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | -40C to +105C |
| Part Status | Obsolete | — |
| Processor Core | — | Power Architecture e300c3 |
| Architecture | — | 32-bit RISC |
| Maximum Core Frequency | — | 400 MHz |
| Datenbusbreite | — | 32 bit |
| Memory Controller | — | DDR1/DDR2 with ECC |
| PCI/PCIe | — | 2x PCI (one configurable as PCIe) |
| USB | — | USB 2.0 (host/device) |
| Security Accelerator | — | SEC 3.x (AES, DES, 3DES, SHA, MD5) |
| TDM Interface | — | Yes (TDM/HOLC/TDM) |
| Gehäuse | — | 620-ball HiCTE BGA (29x29 mm) |
| Versorgungsspannung | — | Dual-rail 3.3V / 1.2V core |
| Process Node | — | 90 nm CMOS |