M1AFS1500-1FG256I - Fusion FPGA 1.5M Gates 256-LBGA | Microchip
Teilenummer: M1AFS1500-1FG256I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $270.75 | $2.707,50 |
| 100 | $248 | $24.800,00 |
| 500 | $225 | $112.500,00 |
| 1.000 | $205 | $205.000,00 |
M1AFS1500-1FG256I Übersicht
A field-programmable gate array (FPGA) is a semiconductor device containing a fabric of configurable logic blocks, routing resources, and I/O cells that designers program to implement custom digital circuits. Unlike ASICs, FPGAs are reprogrammable in the field. The Fusion family extends this concept by integrating configurable analog blocks, flash memory, and clock management on a single monolithic die, positioning it as a complete programmable system-on-chip within the broader power-management and embedded-processing hierarchy.
Key differentiating features of the M1AFS1500-1FG256I include flash-based nonvolatile configuration that retains the program when powered off, Live at Power-Up (LAPU) operation that eliminates the need for external boot configuration, and single-chip integration that removes external configuration PROMs. The 130-nm, 7-layer metal flash-based CMOS process supports up to 350 MHz system performance. The industrial (I) grade supports operation from -40C to +85C.
Technically, the die integrates the programmable fabric, large flash memory blocks (the part listing shows 276480 bits of associated memory resource), comprehensive clock generation and management circuitry, and configurable analog peripherals in a monolithic device. The M1 prefix denotes the Fusion variant with the ARM Cortex-M1 processor embedded, enabling a soft-to-hard migration path for embedded firmware alongside programmable logic in one die.
Typical applications include industrial automation and control, motor drive and power-supply supervision leveraging the mixed-signal analog blocks, embedded systems needing an ARM Cortex-M1 plus FPGA fabric combination, and single-chip designs where nonvolatile, instant-on configuration is required.
A key design consideration is compliance: per distributor data this specific device is RoHS non-compliant and contains lead, so it must not be substituted casually for lead-free (FGG) variants in RoHS-restricted products; verify the appropriate suffix for your regulatory environment.
This page synthesizes distributor listings, drop-in same-footprint alternatives, pricing, and practical design notes not found in the manufacturer datasheet, adding sourcing and selection value for engineers.
Drop-in-Alternativen für M1AFS1500-1FG256I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit M1AFS1500-1FG256I (gleiche Bauform und Footprint) – abweichend in Package, System Gates, Family, Process Technology, Clock Management.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
M1AFS1500-1FGG256
✅ Drop-In✓ Auf Lager
$172.23 / Stück
Datenblatt ansehen →M1AFS1500-2FGG256
✅ Drop-In✓ Auf Lager
$124.5 / Stück
Datenblatt ansehen →M1AFS1500-FG256I
✅ Drop-In✓ Auf Lager
$341.46 / Stück
Datenblatt ansehen →M1AFS1500-FG256K
✅ Drop-In✓ Auf Lager
$341.46 / Stück
Datenblatt ansehen →M1AFS600-2FG256
✅ Drop-In✓ Auf Lager
$46.75 / Stück
Datenblatt ansehen →M7AFS600-FGG256
✅ Drop-In✓ Auf Lager
$232.4 / Stück
Datenblatt ansehen →M1AFS1500-1FG256I Grenzwerte & elektrische Eigenschaften
| Logic Capacity | 1,500,000 system gates |
| User I/O | 119 |
| Processor Core | ARM Cortex-M1 (M1 variant) |
| Memory Resource | 276480 bits |
| Configuration Technology | Flash-based, nonvolatile |
| Process Technology | 130 nm CMOS, 7-layer metal |
| Core Supply Voltage | 1.5 V |
| System Performance | up to 350 MHz |
| Gehäuse | 256-LBGA (FG256) |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +85C (industrial grade, suffix I) |
| Speed Grade | -1 (standard) |
| Power-Up Behavior | Live at Power-Up (LAPU) |
| Analog Functionality | Fusion configurable analog blocks |
| Clock Management | Integrated clock generation and management circuitry |
| RoHS-Status | Non-Compliant (contains lead, per distributor data) |
| Lead-Free Status | Contains Lead |
M1AFS1500-1FG256I 256-lbga (fg256) Pinbelegungsleitfaden
Pinbelegung für M1AFS1500-1FG256I (256-lbga (fg256)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für M1AFS1500-1FG256I.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
M1AFS1500-1FG256I ist geeignet für 6 Anwendungs: Industrial Automation and Control, Power Supply Supervision and Management, Embedded Processing with ARM Cortex-M1, Single-Chip System Integration, Automated Test and Instrumentation, Secure and Instant-On Boot Systems.
Industrial Automation and Control
Microchip positions the Fusion family explicitly for industrial programmable-logic implementations, and the M1AFS1500-1FG256I's industrial -40C to +85C rating plus flash-based Live at Power-Up operation make it a strong fit for factory control nodes, sequencers, and I/O concentration cards. The 1.5M-gate fabric absorbs glue logic, state machines, and communication bridges, while the embedded ARM Cortex-M1 runs the supervisory firmware on the same die, cutting bill-of-materials count. Because configuration is nonvolatile, the controller is functional the instant power is applied - critical for machinery safety interlocks that cannot tolerate a multi-hundred-millisecond boot delay from external configuration devices.
Empfohlen
Power Supply Supervision and Management
Fusion's signature feature is integrated configurable analog circuitry - multi-voltage monitoring and analog-to-digital conversion on the same die as the logic. The M1AFS1500-1FG256I can continuously monitor multiple power rails through its analog blocks, digitize the results, and trigger corrective logic actions (shut-down, sequencing, or alarm signaling) with no external supervisory ICs. The 1.5V core plus on-chip clock generation keeps the total component count for a smart hot-swap or supply-sequencing card to a single device. Engineers benefit from 130-nm process reliability and 350 MHz fabric headroom for fast protection loops, while flash persistence preserves thresholds and policies across power cycles without battery backup or reload.
Empfohlen
Embedded Processing with ARM Cortex-M1
The M1 prefix marks this device as the Fusion variant with an ARM Cortex-M1 hard processor embedded alongside the FPGA fabric, making it a single-chip programmable SoC. Firmware runs on the Cortex-M1 using standard ARM development tools while custom peripherals, accelerators, and interfaces are built in the surrounding 1.5M-gate fabric - a migration path for teams that outgrew soft-core processors. The 276480-bit memory resource holds firmware, buffers, and register files, and the flash fabric means the processor is executing immediately at power-up. This suits smart sensors, protocol translators, and compact control heads where a separate MCU plus FPGA would double board area and fail a single-chip cost target.
Empfohlen
Single-Chip System Integration
For board designs fighting component count, the M1AFS1500-1FG256I replaces several discrete devices: logic fabric, flash configuration memory (on-die), clock generation and management circuitry, analog monitoring, and a processor core in one monolithic 256-ball package. This integration reduces assembly steps, eliminates configuration PROM programming in production, and removes the reliability risk of external boot devices. The 130-nm, 7-layer-metal flash CMOS process provides the density for 1.5 million gates while retaining nonvolatility that SRAM FPGAs cannot offer. Designs such as test adapters, bridge cards, and legacy ASIC rescue projects commonly reach breakeven on integration savings alone, independent of the ARM Cortex-M1 or analog benefits.
Empfohlen
Automated Test and Instrumentation
Test adapters and instrumentation backplanes value the M1AFS1500-1FG256I's combination of 119 user I/O, fast fabric timing up to 350 MHz, and instant-on behavior for fixtures that must be ready before the device-under-test powers. Reconfigurability lets one hardware platform support many test personalities, while flash persistence means settings survive fixture power-down without reconfiguration time at the start of each shift. The embedded Cortex-M1 can run housekeeping firmware (self-test, thermal monitoring via the analog blocks) concurrently with pattern generation in the fabric. Industrial temperature rating supports non-climate-controlled production floors, and the leaded FG256 suffix should be swapped to FGG256 where compliance programs apply.
Empfohlen
Secure and Instant-On Boot Systems
Flash-based FPGAs occupy a distinct niche where instant-on and configuration integrity matter: security gateways, access-control hardware, and systems that must present a functional logic interface within microseconds of power application. The M1AFS1500-1FG256I retains its bitstream in on-chip flash with no external configuration image to intercept or corrupt, and Live at Power-Up operation means I/O and logic are active before a host processor completes reset - useful for bus supervision and tamper-detection fabrics. The 1.5M-gate capacity accommodates substantial security logic alongside the ARM Cortex-M1 supervisor, and industrial -40C to +85C rating covers unconditioned cabinets. Designers should verify flash-programming lock features in the Fusion datasheet.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für M1AFS1500-1FG256I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | M1AFS1500-1FGG256 | M1AFS1500-2FGG256 | M1AFS1500-FG256K | M1AFS600-2FG256 | M7AFS600-FGG256 |
|---|---|---|---|---|---|---|
| Package | 256-LBGA (FG256) | 256-LBGA (FG256) - same footprint | 256-LBGA (FG256) - same footprint | 256-LBGA (FG256) - same footprint | 256-FBGA family - same outline | 256-LBGA (FG256) - same footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Logic Capacity (Gates) | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 600,000 | 600,000 |
| Embedded Core | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 (M1AFS family) | M7 variant (different core option) |
| User I/O | 119 | 119 | 119 | 119 | 119 | 119 |
Wichtigste Unterscheidungsmerkmale
- Nonvolatile flash fabric with Live at Power-Up (vs. M1AFS600-2FG256)
- Single-chip integration eliminates configuration PROM (vs. SRAM FPGAs (Xilinx/Altera equivalents))
- Cost-down migration path within same footprint (vs. M1AFS1500-1FGG256)
Designhinweise
Compliance trap: the FG256 suffix on this part is leaded (RoHS non-compliant, contains lead per distributor data). If your product ships to the EU or any RoHS-restricted market, order the FGG256 lead-free variant instead - it is the same die and footprint, so no PCB or firmware change is required, but the order code must be corrected before production release to avoid a non-compliant BOM.
The device uses a 1.5 V core supply per the FindIC specification listing. Follow the Fusion family datasheet power-supply sequencing and decoupling guidance: flash-based FPGAs have a distinct programming/erase voltage domain, and the integrated analog blocks require clean reference supplies for accurate rail monitoring. Verify exact rail names, sequencing order, and current consumption in the manufacturer datasheet rather than estimating, as Fusion power-up behavior differs from SRAM FPGAs because no external configuration device draws current at boot.
The 256-ball LBGA requires standard fine-pitch BGA layout practice: controlled-impedance stackup for high-speed fabric routing (up to 350 MHz system performance), via-in-pad or doghouse fanout on the 256-ball grid, and solder-mask-defined pads per Microchip package drawing. Allocate multiple ground balls and solid return planes under the die to support the analog blocks' reference integrity. JTAG programming access must be routed to a header even in production, since in-system flash programming and boundary-scan test rely on the TAP chain.
Do not casually migrate bitstreams between speed grades: the M1AFS1500-1 (this part) and -2 grade parts are footprint-compatible, but timing closure achieved on a -2 device does not guarantee the same results on the -1 grade. Re-run static timing analysis in Libero when substituting any alternative, including the lead-free FGG variants, and re-verify analog block calibration if rail-monitoring thresholds depend on process-sensitive parameters.
Compliance-Informationen
Per distributor specification data (DigChip), this part is RoHS non-compliant and contains lead. Use FGG-suffixed variants (e.g., M1AFS1500-1FGG256) for RoHS-compliant designs.