M1AFS1500-1FGG256 vs M1AFS600-1FGG256 Vergleich
Detaillierter Direktvergleich von M1AFS1500-1FGG256 von Microchip Technology und M1AFS600-1FGG256 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
M1AFS1500-1FGG256 - Fusion FPGA 1.5M Gates, 119 I/O | Microchip
M1AFS1500-1FGG256 ✓ AktivMicrochip Technology
M1AFS600-1FGG256 - Fusion FPGA, Cortex-M1, 600K Gates | Microchip
M1AFS600-1FGG256 ✓ AktivSpezifikationsvergleich
| Parameter | M1AFS1500-1FGG256 | M1AFS600-1FGG256 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $172,23 | $191,10 |
| Series | Fusion (M1AFS1500) | — |
| System Gates | 1,500,000 | 600000 |
| Logic Cells | 38,400 | — |
| Embedded Processor | ARM Cortex-M1 | — |
| Maximale Taktfrequenz | 350 MHz | — |
| Number of I/Os | 119 | — |
| Versorgungsspannung | 1.5 V | — |
| Technology | CMOS, 130 nm | — |
| Configuration Memory | Flash-based (non-volatile) | Flash (non-volatile, live at power-up) |
| Gehäuse / Bauform | 256-LBGA (FBGA, S-PBGA-B256) | — |
| Ball Pitch | 1.00 mm | — |
| Montagestil | SMD/SMT | — |
| Minimum Operating Temperature | 0 C | — |
| Maximum Operating Temperature | +70 C | — |
| Packaging | Tray | Tray |
| Speed Grade | -1 | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Integrated Analog Blocks | Yes (configurable analog conditioning and conversion) | — |
| Integrated Flash Memory Blocks | Yes | — |
| Clock Management | Integrated clock generation and management circuitry | — |
| Family | — | Fusion Mixed-Signal FPGA |
| Processor Core | — | ARM Cortex-M1 (hard core) |
| Configurable Logic Blocks (CLBs) | — | 13824 |
| Flip-Flops | — | 110592 |
| User I/O | — | 119 |
| Core Supply Voltage | — | 1.5 V |
| Process Technology | — | 130 nm CMOS, flash-based |
| Betriebstemperatur | — | 0C to +85C |
| Gehäuse | — | 256-ball LBGA (FGG256), 17x17x1.7 mm |
| Montageart | — | Surface Mount |
| Analog Features | — | Configurable analog blocks, clock generation and management |