M1AFS1500-1FGG256 vs M1AFS600-1FGG256 Comparación
Comparación detallada lado a lado de M1AFS1500-1FGG256 por Microchip Technology y M1AFS600-1FGG256 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M1AFS1500-1FGG256 - Fusion FPGA 1.5M Gates, 119 I/O | Microchip
M1AFS1500-1FGG256 ✓ ActivoMicrochip Technology
M1AFS600-1FGG256 - Fusion FPGA, Cortex-M1, 600K Gates | Microchip
M1AFS600-1FGG256 ✓ ActivoComparación de especificaciones
| Parámetro | M1AFS1500-1FGG256 | M1AFS600-1FGG256 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $172,23 | $191,10 |
| Series | Fusion (M1AFS1500) | — |
| System Gates | 1,500,000 | 600000 |
| Logic Cells | 38,400 | — |
| Embedded Processor | ARM Cortex-M1 | — |
| Frecuencia de reloj máxima | 350 MHz | — |
| Number of I/Os | 119 | — |
| Tensión de alimentación | 1.5 V | — |
| Technology | CMOS, 130 nm | — |
| Configuration Memory | Flash-based (non-volatile) | Flash (non-volatile, live at power-up) |
| Encapsulado / Carcasa | 256-LBGA (FBGA, S-PBGA-B256) | — |
| Ball Pitch | 1.00 mm | — |
| Estilo de montaje | SMD/SMT | — |
| Minimum Operating Temperature | 0 C | — |
| Maximum Operating Temperature | +70 C | — |
| Packaging | Tray | Tray |
| Speed Grade | -1 | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | Compliant |
| Integrated Analog Blocks | Yes (configurable analog conditioning and conversion) | — |
| Integrated Flash Memory Blocks | Yes | — |
| Clock Management | Integrated clock generation and management circuitry | — |
| Family | — | Fusion Mixed-Signal FPGA |
| Processor Core | — | ARM Cortex-M1 (hard core) |
| Configurable Logic Blocks (CLBs) | — | 13824 |
| Flip-Flops | — | 110592 |
| User I/O | — | 119 |
| Core Supply Voltage | — | 1.5 V |
| Process Technology | — | 130 nm CMOS, flash-based |
| Temperatura de funcionamiento | — | 0C to +85C |
| Encapsulado | — | 256-ball LBGA (FGG256), 17x17x1.7 mm |
| Tipo de montaje | — | Surface Mount |
| Analog Features | — | Configurable analog blocks, clock generation and management |