M1AFS1500-1FGG484 vs M1AFS1500-2FG676I Vergleich
Detaillierter Direktvergleich von M1AFS1500-1FGG484 von Microchip Technology und M1AFS1500-2FG676I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
M1AFS1500-1FGG484 - Fusion FPGA 1.5M Gates, 223 I/O | Microchip
M1AFS1500-1FGG484 ✓ AktivMicrochip Technology
M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip
M1AFS1500-2FG676I ✓ AktivSpezifikationsvergleich
| Parameter | M1AFS1500-1FGG484 | M1AFS1500-2FG676I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $405,00 |
| Family | Fusion Mixed-Signal FPGA (M1 series) | Fusion (Mixed-Signal Flash FPGA) |
| System Gates | 1,500,000 | 1.5 M |
| Logic Cells | 38,400 | — |
| User I/O | 223 | — |
| Flash Memory | 276,480 bits | — |
| Embedded Processor | ARM Cortex-M1 | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Process Technology | 130 nm flash-based | 130 nm CMOS |
| Maximale Taktfrequenz | 350 MHz | — |
| Gehäuse | 484-ball FBGA (FGG484) | 676-ball FBGA (FG676) |
| Montageart | Surface Mount | Surface Mount |
| Terminal Form | Ball (BGA), square package | — |
| Configuration Memory | Non-volatile on-chip flash | On-chip flash (non-volatile, instant-on) |
| Analog Blocks | Configurable analog (ADC, voltage/current monitors) | — |
| Clock Management | CCC with integrated PLLs | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | — |
| Packaging | Tray | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | RoHS Non-Compliant (contains lead) |
| Speed Grade | — | 2 |
| Betriebstemperaturbereich | — | Industrial (I suffix) -40C to +100C |
| Embedded Analog Features | — | On-chip ADC, clock conditioning circuit (CCC), power-on reset |
| External Configuration Device | — | Not required |
| Lead Free Status | — | Contains Lead |
| Packaging Method | — | Tray |
| Number of User I/O | — | [DATA_NEEDED: Number of User I/O] |
| Embedded SRAM | — | [DATA_NEEDED: Embedded SRAM capacity] |
| DLL/PLL Blocks | — | [DATA_NEEDED: Number of CCC blocks] |