M1AFS1500-1FGG484 vs M1AFS1500-2FG676I Comparaison
Comparaison détaillée côte à côte de M1AFS1500-1FGG484 par Microchip Technology et M1AFS1500-2FG676I par Microchip Technology. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Microchip Technology
M1AFS1500-1FGG484 - Fusion FPGA 1.5M Gates, 223 I/O | Microchip
M1AFS1500-1FGG484 ✓ ActifMicrochip Technology
M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip
M1AFS1500-2FG676I ✓ ActifComparaison des spécifications
| Paramètre | M1AFS1500-1FGG484 | M1AFS1500-2FG676I |
|---|---|---|
| Marque | Microchip Technology | Microchip Technology |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $405,00 |
| Family | Fusion Mixed-Signal FPGA (M1 series) | Fusion (Mixed-Signal Flash FPGA) |
| System Gates | 1,500,000 | 1.5 M |
| Logic Cells | 38,400 | — |
| User I/O | 223 | — |
| Flash Memory | 276,480 bits | — |
| Embedded Processor | ARM Cortex-M1 | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Process Technology | 130 nm flash-based | 130 nm CMOS |
| Fréquence d'horloge maximale | 350 MHz | — |
| Boîtier | 484-ball FBGA (FGG484) | 676-ball FBGA (FG676) |
| Type de montage | Surface Mount | Surface Mount |
| Terminal Form | Ball (BGA), square package | — |
| Configuration Memory | Non-volatile on-chip flash | On-chip flash (non-volatile, instant-on) |
| Analog Blocks | Configurable analog (ADC, voltage/current monitors) | — |
| Clock Management | CCC with integrated PLLs | — |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | — |
| Packaging | Tray | — |
| Statut RoHS | [DATA_NEEDED: RoHS status] | RoHS Non-Compliant (contains lead) |
| Speed Grade | — | 2 |
| Plage de température de fonctionnement | — | Industrial (I suffix) -40C to +100C |
| Embedded Analog Features | — | On-chip ADC, clock conditioning circuit (CCC), power-on reset |
| External Configuration Device | — | Not required |
| Lead Free Status | — | Contains Lead |
| Packaging Method | — | Tray |
| Number of User I/O | — | [DATA_NEEDED: Number of User I/O] |
| Embedded SRAM | — | [DATA_NEEDED: Embedded SRAM capacity] |
| DLL/PLL Blocks | — | [DATA_NEEDED: Number of CCC blocks] |