M1AFS1500-1FGG484 vs M1AFS1500-2FG676I Comparação

Comparação detalhada lado a lado de M1AFS1500-1FGG484 por Microchip Technology e M1AFS1500-2FG676I por Microchip Technology. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Microchip Technology
M1AFS1500-1FGG484 M1AFS1500-1FGG484 - Fusion FPGA 1.5M Gates, 223 I/O | Microchip

M1AFS1500-1FGG484 - Fusion FPGA 1.5M Gates, 223 I/O | Microchip

M1AFS1500-1FGG484 ✓ Ativo
Microchip Technology
M1AFS1500-2FG676I M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip

M1AFS1500-2FG676I - 1.5M-Gate Fusion FPGA, FBGA-676 | Microchip

M1AFS1500-2FG676I ✓ Ativo

Comparação de especificações

Parâmetro M1AFS1500-1FGG484 M1AFS1500-2FG676I
Marca Microchip Technology Microchip Technology
Categoria FPGA & CPLD FPGA & CPLD
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $0,00 $405,00
Family Fusion Mixed-Signal FPGA (M1 series) Fusion (Mixed-Signal Flash FPGA)
System Gates 1,500,000 1.5 M
Logic Cells 38,400 —
User I/O 223 —
Flash Memory 276,480 bits —
Embedded Processor ARM Cortex-M1 —
Core Supply Voltage 1.5 V 1.5 V
Process Technology 130 nm flash-based 130 nm CMOS
Frequência máxima de clock 350 MHz —
Encapsulamento 484-ball FBGA (FGG484) 676-ball FBGA (FG676)
Tipo de montagem Surface Mount Surface Mount
Terminal Form Ball (BGA), square package —
Configuration Memory Non-volatile on-chip flash On-chip flash (non-volatile, instant-on)
Analog Blocks Configurable analog (ADC, voltage/current monitors) —
Clock Management CCC with integrated PLLs —
Temperatura de operação [DATA_NEEDED: operating temperature range] —
Packaging Tray —
Status RoHS [DATA_NEEDED: RoHS status] RoHS Non-Compliant (contains lead)
Speed Grade — 2
Faixa de temperatura de operação — Industrial (I suffix) -40C to +100C
Embedded Analog Features — On-chip ADC, clock conditioning circuit (CCC), power-on reset
External Configuration Device — Not required
Lead Free Status — Contains Lead
Packaging Method — Tray
Number of User I/O — [DATA_NEEDED: Number of User I/O]
Embedded SRAM — [DATA_NEEDED: Embedded SRAM capacity]
DLL/PLL Blocks — [DATA_NEEDED: Number of CCC blocks]

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