M7AFS600-FGG256 vs M7AFS600-1FGG256I Vergleich
Detaillierter Direktvergleich von M7AFS600-FGG256 von Microchip Technology und M7AFS600-1FGG256I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
M7AFS600-FGG256 - Fusion FPGA 600K Gates 256-BGA | Microchip
M7AFS600-FGG256 ✓ AktivMicrochip Technology
M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip
M7AFS600-1FGG256I ✓ AktivSpezifikationsvergleich
| Parameter | M7AFS600-FGG256 | M7AFS600-1FGG256I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $232,40 | $0,00 |
| Family | Fusion (M7AFS600) | Fusion (Mixed-Signal Flash FPGA) |
| System Gates | 600K | 600K |
| Flip-Flops | 110592 | — |
| User I/O | 119 | — |
| Embedded Processor | ARM CoreMP7 | — |
| Core Supply Voltage | 1.5 V | — |
| Process Technology | 130 nm flash-based | 130 nm, 7-layer metal flash-based CMOS |
| Maximum Frequency | 1098.9 MHz (distributor listing) | — |
| Gehäuse | 256-LBGA / 256-FBGA | — |
| Ball Pitch | 1 mm | — |
| Montageart | Surface Mount | — |
| Configuration Memory | Flash (single-chip, non-volatile) | Flash (nonvolatile) |
| Analog Features | Integrated configurable analog blocks, clock generation and management | — |
| Betriebstemperatur | [DATA_NEEDED: Operating Temperature Range] | — |
| Packaging | Tray | Tray |
| RoHS-Status | [DATA_NEEDED: RoHS Status] | [DATA_NEEDED: RoHS status] |
| MSL-Level | [DATA_NEEDED: Moisture Sensitivity Level] | — |
| Processor Core | — | ARM CoreMP7 |
| Number of I/O | — | 119 |
| Betriebsversorgungsspannung | — | 1.5 V |
| System Performance | — | Up to 350 MHz |
| Speed Grade | — | -1 |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Gehäuse / Bauform | — | 256-Ball FBGA (FGG256) |
| Montagestil | — | SMD/SMT |
| Series | — | M7AFS600 |
| Live at Power-Up (LAPU) | — | Yes |
| Analog Subsystem | — | Integrated ADC, voltage/temperature monitors (per Fusion family datasheet) |