MAX165BCWN vs MAX166DCPP Vergleich
Detaillierter Direktvergleich von MAX165BCWN von Maxim Integrated und MAX166DCPP von Maxim Integrated. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Maxim Integrated
MAX165BCWN - 5µs 8-Bit ADC with Track/Hold, SOIC-18 | Maxim Integrated
MAX165BCWN Nrnd
Spezifikationsvergleich
| Parameter | MAX165BCWN | MAX166DCPP |
|---|---|---|
| Marke | Maxim Integrated | Maxim Integrated |
| Kategorie | ADC/DAC | ADC/DAC |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $12,40 | $8,40 |
| Auflösung | 8 bit | 8 bit |
| Conversion Time | 5 µs | 5 µs |
| Abtastrate | 200 kSPS | — |
| Number of Channels | 1 | 1 single-ended input |
| Input Type | Single-Ended (MAX165) / Differential (MAX166) | — |
| Eingangsspannungsbereich | 0 V to 2×VREF (≈ 2.46 V with internal reference) | — |
| Architecture | SAR (Successive Approximation Register) | — |
| Data Interface | Parallel (8-bit) with CS, RD control signals | — |
| Versorgungsspannung | +5 V ±5% (single supply) | — |
| Internal Reference | +1.23 V (can be overdriven externally) | — |
| Track/Hold Bandwidth | Full-scale signals up to 50 kHz (386 mV/µs slew rate) | — |
| Betriebstemperatur | 0°C to +70°C (commercial grade) | — |
| Gehäuse | 18-SOIC (Wide, 0.300") | 20-PDIP (Plastic DIP, 0.300 inch) |
| Package Body Width | 7.50 mm (0.295") | — |
| Montageart | Surface Mount | Through-Hole |
| RoHS-Status | Compliant (lead-free available on '+' variants) | Compliant |
| MSL-Level | 1 | — |
| Conversion Method | — | Successive Approximation (SAR) |
| Throughput Rate | — | 200 ksps |
| Input Track/Hold Bandwidth | — | Full-scale signals up to 50 kHz (386 mV/µs slew rate) |
| Internal Reference Voltage | — | 2.46 V |
| Analog Supply Voltage | — | +5 V (single supply) |
| Digital Interface | — | Parallel, μP-compatible (RD/CS logic) |
| Betriebstemperaturbereich | — | [DATA_NEEDED: temperature grade code details] |
| Anzahl der Pins | — | 20 |
| Power Dissipation (typical) | — | 30 mW |
| Process Technology | — | CMOS |