MC56F8166VFVE vs MC56F8155VFGE Vergleich
Detaillierter Direktvergleich von MC56F8166VFVE von NXP Semiconductors und MC56F8155VFGE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC56F8166VFVE - 16-Bit 56800E DSC, 512KB Flash, 144-LQFP | NXP
MC56F8166VFVE ObsoleteNXP Semiconductors
MC56F8155VFGE - 16-bit DSC, 256KB Flash, 40MHz, LQFP-128 | NXP
MC56F8155VFGE ObsoleteSpezifikationsvergleich
| Parameter | MC56F8166VFVE | MC56F8155VFGE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $11,23 | $10,20 |
| Core Processor | 56800E (16-bit) | 56800E |
| Core Size | 16-Bit | 16-Bit |
| Maximum Core Speed | 40 MHz | — |
| Program Memory Size | 512 KB (256K x 16) Flash | 256 KB (128K x 16) Flash |
| RAM Size | 16 KB | 8 KB (4K x 16) |
| EEPROM Size | Not present (Flash-based emulation) | — |
| Number of I/O | 62 | 49 |
| Connectivity | EBI/EMI, SCI, SPI | EBI/EMI, SCI, SPI |
| Peripherals | POR, PWM, WDT | POR, PWM, WDT |
| Gehäuse | 144-LQFP (20 x 20 mm) | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | -40C to +105C (extended industrial) | [DATA_NEEDED: operating temperature range] |
| Versorgungsspannung | 3.0 V to 3.6 V | [DATA_NEEDED: supply voltage range] |
| Data Converters | A/D (peripherals present; channel count not in verified data) | — |
| RoHS-Status | Compliant (per distributor listings) | [DATA_NEEDED: RoHS compliance] |
| Lead-Free | Yes | — |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | 3 (168 hours) - per JEDEC J-STD-020 (typical for LQFP) | — |
| Part Status | Obsolete (last-time-buy inventory through authorised distributors) | — |
| Core Speed | — | 40 MHz |
| Gehäuse / Bauform | — | 128-LQFP (14x20 mm) |
| Oscillator Type | — | External |
| Packaging | — | Tray |
| Architecture | — | Harvard (unified address space) |
| Data Converter | — | [DATA_NEEDED: ADC resolution and channels] |