MC56F8322MFA60 vs MC56F8322MFAE Vergleich

Detaillierter Direktvergleich von MC56F8322MFA60 von NXP Semiconductors und MC56F8322MFAE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC56F8322MFA60 MC56F8322MFA60 - 60MHz 16-bit DSC 48-LFQFP | NXP Semiconductors

MC56F8322MFA60 - 60MHz 16-bit DSC 48-LFQFP | NXP Semiconductors

MC56F8322MFA60 ✓ Aktiv
NXP Semiconductors
MC56F8322MFAE MC56F8322MFAE - 60MHz 56800E DSC, 32KB Flash | NXP LQFP-48

MC56F8322MFAE - 60MHz 56800E DSC, 32KB Flash | NXP LQFP-48

MC56F8322MFAE Nrnd

Spezifikationsvergleich

Parameter MC56F8322MFA60 MC56F8322MFAE
Marke NXP Semiconductors NXP Semiconductors
Kategorie DSP Microcontrollers
Lebenszyklusstatus Aktiv NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $7,50 $8,75
Core Architecture 56800E (Harvard-style, 16-bit) —
Core Frequency 60 MHz —
Instruction Throughput 60 MIPS —
Operations per Cycle Up to 6 —
Program Memory Flash (on-chip) [DATA_NEEDED: program flash size in KB] —
Data Memory RAM (on-chip) [DATA_NEEDED: RAM size in KB] —
Gehäuse 48-pin LFQFP, 7x7 mm, gull-wing 48-LQFP (7x7 mm)
Temperature Grade Automotive Automotive
Betriebstemperatur -40C to +125C (automotive grade) —
ADC Dual 12-bit ADC [DATA_NEEDED: channel count] —
PWM Module Flex PWM (multi-channel, three-phase capable) —
Serial Peripherals SCI, SPI, I2C, CAN —
Timers Quad timers (on-chip) [DATA_NEEDED: exact count] —
Versorgungsspannung 3.3 V (typical) [DATA_NEEDED: full range] —
Montageart Surface Mount (LFQFP) Surface Mount
RoHS-Status Compliant (per distributor data) [DATA_NEEDED: RoHS status]
Core — 56800E
Datenbusbreite — 16 bit
Maximale Taktfrequenz — 60 MHz
Sustained Throughput — 60 MIPS
Program Memory Size — 32 KB (16K x 16) Flash
Betriebsversorgungsspannung — 2.5 V core / 3.3 V I/O
Betriebstemperaturbereich — -40 C to +105 C (automotive grade)
Number of I/Os — 21
Communication Interfaces — CAN, SCI, SPI
Architecture — Harvard, 3 execution units, up to 6 ops/cycle
MSL-Level — [DATA_NEEDED: MSL rating]

Datenblätter & Ressourcen

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