MC68CK16Z1CAG16 - 16-Bit HC16 16MHz ROMless MCU | NXP
Teilenummer: MC68CK16Z1CAG16 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $17.05 | $170,50 |
| 100 | $15.4 | $1.540,00 |
| 500 | $13.95 | $6.975,00 |
| 1.000 | $12.6 | $12.600,00 |
MC68CK16Z1CAG16 Übersicht
An MCU (Microcontroller Unit) is a single-chip computer that integrates a CPU core, memory, and input/output subsystems on one die. The HC16 family is a 16-bit CISC architecture positioned between the 8-bit 68HC11 family and the 32-bit ColdFire families in NXP's legacy M68K lineage, addressing automotive and high-performance embedded control applications. The 68HC16Z1 specifically combines a true 16-bit CPU with powerful peripheral subsystems interconnected through a common inter-module bus (IMB).
Key features include a 16-bit CPU16 core running at 16 MHz, 1 KB of on-chip RAM for data storage, ROMless architecture requiring external program memory, internal oscillator support, and automotive-grade qualification. The 144-LQFP form factor provides 16 or more general-purpose I/O pins and exposes the full address/data bus needed for external memory expansion. The 'CK' part designator indicates the industrial temperature grade.
The CPU16 architecture supports 16-bit data paths, addressing modes optimized for embedded control, and tight integration with on-chip peripherals through the standard inter-module bus. This makes the part suitable for designs originally targeted at the 68HC11 instruction set that require higher throughput and a wider address space.
Typical applications include automotive body and chassis control, industrial automation controllers, sensor interface modules, and legacy embedded systems that need a 68HC11-compatible instruction set with 16-bit performance headroom. The ROMless design allows designers to pair the MCU with external EPROM, Flash, or EEPROM for flexible firmware development.
When designing with this part, note that it is marked End-of-Life by NXP - new designs should consider ColdFire or Kinetis family replacements unless the 68HC16 instruction-set compatibility is mandatory for firmware reuse.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the original datasheet.
Drop-in-Alternativen für MC68CK16Z1CAG16 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC68CK16Z1CAG16 (gleiche Bauform und Footprint) – abweichend in Package, Supply Voltage, Program Memory Size, Core Architecture, Core Processor.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC68HC16Z1CAG16
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC68HC16Z1MAG16
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →MC9S12H256VFVE
✅ Drop-In✓ Auf Lager
$10.95 / Stück
Datenblatt ansehen →MC9S12D64MFUER
✅ Drop-In✓ Auf Lager
$1.0524 / Stück
Datenblatt ansehen →MC9S12DG128MPV
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →MC68CK16Z1CAG16 Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP Semiconductors |
| Series | HC16 |
| Core Processor | CPU16 |
| Core Size | 16-Bit |
| Core Architecture | CISC |
| Speed | 16 MHz |
| Program Memory Type | ROMless |
| Program Memory Size | External (ROMless) |
| RAM Size | 1 KB |
| Number of I/O | 16+ |
| Oscillator Type | Internal |
| Versorgungsspannung | 3.3 V / 5 V |
| Gehäuse | 144-LQFP (20x20 mm) |
| Montageart | Surface Mount |
| Operating Temperature Grade | Industrial ('CK' suffix) |
| Automotive Qualified | Yes (Automotive family) |
| Instruction Set Compatibility | Upward code-compatible with 68HC11 family |
| Inter-Module Bus (IMB) | Yes |
| RoHS-Status | Compliant |
| Lebenszyklusstatus | End of Life (EOL) |
MC68CK16Z1CAG16 144-lqfp (20x20 mm) Pinbelegungsleitfaden
Pinbelegung für MC68CK16Z1CAG16 (144-lqfp (20x20 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MC68CK16Z1CAG16.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MC68CK16Z1CAG16 ist geeignet für 6 Anwendungs: Automotive Body and Chassis Control, Industrial Automation Controllers, Legacy 68HC11 Firmware Upgrade Path, Sensor Interface Modules, Instrumentation and Test Equipment Front-Ends, Embedded Control for Motor Drives.
Automotive Body and Chassis Control
The MC68CK16Z1CAG16 fits automotive body and chassis ECUs because the CPU16 architecture gives 16-bit throughput at 16 MHz, enough headroom for body controllers, lighting modules, and small chassis nodes. Its ROMless design lets OEMs pair it with external Flash for calibration and end-of-line programming. The industrial temperature grade ('CK') covers -40 C to +85 C operation, while the automotive-qualified 68HC16Z1 siblings extend this to 125 C. The 144-LQFP package exposes the full external bus needed for off-chip memory and CAN/LIN transceivers typical of body controllers.
Empfohlen
Industrial Automation Controllers
In PLCs, motor-control front-ends, and sensor hubs, the MC68CK16Z1CAG16 provides 16-bit deterministic control with HC11 software reuse. Its ROMless architecture supports external program memory so designers can iterate firmware easily. The 144-LQFP package offers enough pins for parallel I/O expansion, encoder interfaces, and discrete driver lines. Designers should add external watchdog and brown-out circuits to harden industrial installations against supply transients.
Empfohlen
Legacy 68HC11 Firmware Upgrade Path
Engineers porting 68HC11 firmware to a higher-throughput core can drop in the MC68CK16Z1CAG16 because CPU16 is upward code-compatible with 68HC11 instructions. The 144-LQFP 'CAG' footprint matches the family pinout family so existing PCB layouts are reusable with minimal rework. The 16 MHz core clock roughly doubles 68HC11 throughput, easing timing budgets in interrupt-driven firmware. ROMless operation lets existing EPROM/Flash boards keep their memory devices unchanged.
Empfohlen
Sensor Interface Modules
Smart sensor concentrators and analog front-end controllers use the MC68CK16Z1CAG16 to aggregate data from multiple transducers and forward it over CAN or serial links. The CPU16 core handles 16-bit sensor data natively, while the ROMless design lets calibration tables live in external memory that can be updated per sensor variant. The internal oscillator plus external crystal option simplifies BOM while keeping timing accurate enough for CAN 2.0B.
Empfohlen
Instrumentation and Test Equipment Front-Ends
Test-and-measurement front-ends that need deterministic 68HC11-compatible code benefit from the MC68CK16Z1CAG16's CPU16 core and ROMless flexibility. External program memory allows large calibration firmware, while the 144-LQFP package exposes enough I/O for parallel ADC/DAC interfaces, keypad scans, and display buses. Designers moving from 68HC11 can reuse legacy assembly with minimal rework, keeping time-to-market low for long-life test platforms.
Empfohlen
Embedded Control for Motor Drives
Small motor-control boards for pumps, fans, and BLDC drivers can use the MC68CK16Z1CAG16 as the main controller. The CPU16 handles PWM timing, commutation tables, and current-loop math at 16 MHz, while the ROMless design allows the field-oriented-control firmware to live in updatable external Flash. The 144-LQFP package provides ample I/O for Hall sensors, gate-driver enables, and fault inputs in a single-chip solution.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC68CK16Z1CAG16 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC68HC16Z1CAG16 | MC68HC16Z1MAG16 | MC9S12H256VFVE | MC9S12D64MFUER | MC9S12DG128MPV |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-LQFP (20x20) | 144-LQFP (20x20) - same | 144-LQFP (20x20) - same | 144-LQFP - same | 144-LQFP - same | 144-LQFP - same |
| Core | CPU16 | CPU16 (same family) | CPU16 (same family) | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) |
| Max Clock | 16 MHz | 16 MHz | 16 MHz | 25 MHz (faster) | 25 MHz (faster) | 25 MHz (faster) |
| Program Memory | ROMless (external) | ROMless (external) | ROMless (external) | 256 KB Flash (on-chip) | 64 KB Flash (on-chip) | 128 KB Flash (on-chip) |
| RAM Size | 1 KB | 1 KB | 1 KB | 12 KB | 4 KB | 8 KB |
| Supply Voltage | 3.3 V / 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Temperature Grade | Industrial (CK) | Industrial | Automotive (MAG) | Automotive (VFE) | Industrial | Industrial |
| Lifecycle Status | EOL | EOL | EOL | Active | Active | Active |
Wichtigste Unterscheidungsmerkmale
- CPU16 instruction-set compatibility with 68HC11 (vs. MC9S12H256VFVE)
- ROMless flexibility for last-minute firmware changes (vs. MC9S12H256VFVE)
- Industrial temperature grade ('CK' suffix) (vs. MC68HC16Z1MAG16)
- Same-family pin-compatible alternative available (vs. MC68HC16Z1CAG16)
Designhinweise
Confirmed: MC68CK16Z1CAG16 is declared End-of-Life by NXP. The NXP product page lists 'End of Life Overview', 'Discontinuance and Replacement', and 'Product Change Notice' sections, so new production designs should NOT select this part. Use NXP's recommended ColdFire or Kinetis successors, or a same-family pin-compatible 68HC16Z1 variant only when reusing existing firmware is mandatory.
The part is ROMless: firmware lives in external EPROM/Flash on the expansion bus. Designers must add bus-arbiter glue logic, address latches, and chip-select decoding. Omitting wait-state logic on slower external memory causes intermittent bus faults that look like software bugs - always validate bus timing with the 16 MHz core clock assumption.
Estimated: at 5 V VDD, 16 MHz CPU clock, and typical HC16Z1 core current of about 50 mA, the part dissipates roughly 0.25 W. The 144-LQFP package offers adequate thermal margin at industrial temperatures, but designers should still provide a ground plane under the exposed pad region and follow NXP's recommended decoupling network (one 100 nF per VDD pin pair plus one 4.7 uF bulk cap near the IC).
Estimated: route the address and data lines with short, impedance-controlled traces because the 16 MHz external bus is sensitive to reflections. Place external program memory on the same board side as the MCU, keep trace lengths matched within 25 mm, and provide a contiguous ground return path to avoid EMI on the bus. Add series damping resistors (22-33 ohm) on heavily-loaded address lines if multiple memories are multiplexed.
Compliance-Informationen
RoHS compliant per NXP product listing. Reach, halogen-free, and conflict-mineral status not stated in verified web sources. AEC-Q100 not applicable - the CK suffix indicates industrial grade; for automotive choose the MC68HC16Z1MAG16 variant.
