MC68HC11E0CFN2R2 vs MC68HC11E1CFNE3R Vergleich

Detaillierter Direktvergleich von MC68HC11E0CFN2R2 von NXP Semiconductors und MC68HC11E1CFNE3R von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC68HC11E0CFN2R2 MC68HC11E0CFN2R2 - 8-Bit 2MHz ROMless HC11 MCU, 52-PLCC | NXP

MC68HC11E0CFN2R2 - 8-Bit 2MHz ROMless HC11 MCU, 52-PLCC | NXP

MC68HC11E0CFN2R2 Nrnd
NXP Semiconductors
MC68HC11E1CFNE3R MC68HC11E1CFNE3R - 8-Bit 3MHz MCU 512B EE ROMless PLCC-52 | NXP

MC68HC11E1CFNE3R - 8-Bit 3MHz MCU 512B EE ROMless PLCC-52 | NXP

MC68HC11E1CFNE3R ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter MC68HC11E0CFN2R2 MC68HC11E1CFNE3R
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND Letzte Kaufgelegenheit
Lagerstatus In Stock In Stock
Stückpreis (USD) $15,85 $9,80
Core Architecture M68HC11 8-bit CISC CISC
Bus Frequency 2 MHz —
Program Memory ROMless (0 bytes on-chip) —
RAM 256 bytes —
On-chip ROM 0 bytes (ROMless) —
On-chip EEPROM 0 bytes —
Versorgungsspannung 3.0 V to 5.5 V (4.5 V to 5.5 V for full speed) 5 V
A/D Converter 8 channels x 8-bit —
Serial Interfaces 1x SCI (async NRZ), 1x SPI —
Timer 16-bit with IC/OC + pulse accumulator —
I/O Pins Up to 38 bidirectional —
Gehäuse 52-PLCC (FN package), 19.13 x 19.13 mm 52-PLCC (FN) 19.1 x 19.1 mm
Lead Style J-bend (PLCC) —
Betriebstemperatur -40C to +85C (industrial) -40C to +85C (industrial)
Montageart Surface Mount Surface Mount
MSL-Level [DATA_NEEDED: MSL level per J-STD-020] —
RoHS-Status unknown - legacy part —
Core Processor — HC11
Core Size — 8-Bit
Maximum Clock Speed — 3 MHz
Program Memory Size — ROMless (none on-chip)
Program Memory Type — ROMless
EEPROM Size — 512 x 8 bytes
RAM Size — 512 x 8 bytes
Number of I/O — 38
Connectivity — SCI, SPI
Peripherals — POR, WDT
Datenbusbreite — 8-Bit
Packaging — Tape & Reel (R suffix)

Datenblätter & Ressourcen

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