MC68HC11E0CFN2R2 vs MC68HC11E1CFNE3R 对比

详细并排对比 MC68HC11E0CFN2R2 出自 NXP Semiconductors 和 MC68HC11E1CFNE3R 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MC68HC11E0CFN2R2 MC68HC11E0CFN2R2 - 8-Bit 2MHz ROMless HC11 MCU, 52-PLCC | NXP

MC68HC11E0CFN2R2 - 8-Bit 2MHz ROMless HC11 MCU, 52-PLCC | NXP

MC68HC11E0CFN2R2 Nrnd
NXP Semiconductors
MC68HC11E1CFNE3R MC68HC11E1CFNE3R - 8-Bit 3MHz MCU 512B EE ROMless PLCC-52 | NXP

MC68HC11E1CFNE3R - 8-Bit 3MHz MCU 512B EE ROMless PLCC-52 | NXP

MC68HC11E1CFNE3R ⚠ 最后一次采购

规格对比

参数 MC68HC11E0CFN2R2 MC68HC11E1CFNE3R
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 不推荐新设计 最后采购期
库存状态 有库存 有库存
单价(USD) $15.85 $9.80
Core Architecture M68HC11 8-bit CISC CISC
Bus Frequency 2 MHz —
Program Memory ROMless (0 bytes on-chip) —
RAM 256 bytes —
On-chip ROM 0 bytes (ROMless) —
On-chip EEPROM 0 bytes —
电源电压 3.0 V to 5.5 V (4.5 V to 5.5 V for full speed) 5 V
A/D Converter 8 channels x 8-bit —
Serial Interfaces 1x SCI (async NRZ), 1x SPI —
Timer 16-bit with IC/OC + pulse accumulator —
I/O Pins Up to 38 bidirectional —
封装 52-PLCC (FN package), 19.13 x 19.13 mm 52-PLCC (FN) 19.1 x 19.1 mm
Lead Style J-bend (PLCC) —
工作温度 -40C to +85C (industrial) -40C to +85C (industrial)
安装类型 Surface Mount Surface Mount
MSL 等级 [DATA_NEEDED: MSL level per J-STD-020] —
RoHS 状态 unknown - legacy part —
Core Processor — HC11
Core Size — 8-Bit
Maximum Clock Speed — 3 MHz
Program Memory Size — ROMless (none on-chip)
Program Memory Type — ROMless
EEPROM Size — 512 x 8 bytes
RAM Size — 512 x 8 bytes
Number of I/O — 38
Connectivity — SCI, SPI
Peripherals — POR, WDT
数据总线宽度 — 8-Bit
Packaging — Tape & Reel (R suffix)

数据手册与资源

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