MC68HC11E0CFN2R2 vs MC68HC11E1CFNE3R 비교

다음의 상세 나란히 비교: MC68HC11E0CFN2R2 제조: NXP Semiconductors 및 MC68HC11E1CFNE3R 제조: NXP Semiconductors. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

NXP Semiconductors
MC68HC11E0CFN2R2 MC68HC11E0CFN2R2 - 8-Bit 2MHz ROMless HC11 MCU, 52-PLCC | NXP

MC68HC11E0CFN2R2 - 8-Bit 2MHz ROMless HC11 MCU, 52-PLCC | NXP

MC68HC11E0CFN2R2 Nrnd
NXP Semiconductors
MC68HC11E1CFNE3R MC68HC11E1CFNE3R - 8-Bit 3MHz MCU 512B EE ROMless PLCC-52 | NXP

MC68HC11E1CFNE3R - 8-Bit 3MHz MCU 512B EE ROMless PLCC-52 | NXP

MC68HC11E1CFNE3R ⚠ 최종 구매

사양 비교

파라미터 MC68HC11E0CFN2R2 MC68HC11E1CFNE3R
브랜드 NXP Semiconductors NXP Semiconductors
카테고리 Microcontrollers Microcontrollers
수명 주기 상태 NRND 최종 구매
재고 상태 In Stock In Stock
단가 (USD) $15.85 $9.80
Core Architecture M68HC11 8-bit CISC CISC
Bus Frequency 2 MHz —
Program Memory ROMless (0 bytes on-chip) —
RAM 256 bytes —
On-chip ROM 0 bytes (ROMless) —
On-chip EEPROM 0 bytes —
공급 전압 3.0 V to 5.5 V (4.5 V to 5.5 V for full speed) 5 V
A/D Converter 8 channels x 8-bit —
Serial Interfaces 1x SCI (async NRZ), 1x SPI —
Timer 16-bit with IC/OC + pulse accumulator —
I/O Pins Up to 38 bidirectional —
패키지 52-PLCC (FN package), 19.13 x 19.13 mm 52-PLCC (FN) 19.1 x 19.1 mm
Lead Style J-bend (PLCC) —
동작 온도 -40C to +85C (industrial) -40C to +85C (industrial)
실장 유형 Surface Mount Surface Mount
MSL 레벨 [DATA_NEEDED: MSL level per J-STD-020] —
RoHS 상태 unknown - legacy part —
Core Processor — HC11
Core Size — 8-Bit
Maximum Clock Speed — 3 MHz
Program Memory Size — ROMless (none on-chip)
Program Memory Type — ROMless
EEPROM Size — 512 x 8 bytes
RAM Size — 512 x 8 bytes
Number of I/O — 38
Connectivity — SCI, SPI
Peripherals — POR, WDT
데이터 버스 폭 — 8-Bit
Packaging — Tape & Reel (R suffix)

데이터시트 & 자료

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