MC68LK332ACAG16 vs MC68332AMEH16 Vergleich
Detaillierter Direktvergleich von MC68LK332ACAG16 von NXP Semiconductors und MC68332AMEH16 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC68LK332ACAG16 - 32-Bit CPU32 MCU 16.78MHz | NXP | Industrial Control
MC68LK332ACAG16 ✗ AbgekündigtNXP Semiconductors
MC68332AMEH16 - 16MHz 32-Bit ROMless MCU | NXP | Industrial
MC68332AMEH16 ✗ AbgekündigtSpezifikationsvergleich
| Parameter | MC68LK332ACAG16 | MC68332AMEH16 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $19,75 | $15,45 |
| Core Processor | CPU32 (M683xx) | — |
| Core Size | 32-Bit | — |
| Max Clock Frequency | 16.78 MHz | — |
| Program Memory Type | ROMless (external memory) | — |
| RAM Size | 2 KB | — |
| Peripherals | TPU, QSM (QSPI + SCI), SIM | — |
| Versorgungsspannung | 5 V | — |
| Betriebstemperatur | [DATA_NEEDED: Operating Temperature] | — |
| Gehäuse | 144-LQFP (20x20 mm) | 132-pin PQFP |
| Montageart | Surface Mount | Surface mount |
| Connectivity | QSPI, SCI (UART) | — |
| Bus Architecture | Intermodule Bus (IMB) | Intermodule bus |
| External Bus Interface | External data/address bus for ROMless operation | — |
| Qualification | AEC-Q100 (per distributor listing) | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status] |
| Lebenszyklusstatus | End of Life (per NXP product page) | — |
| Programmability | Not verified / Programmable (external code) | — |
| Product Type | — | 32-bit microcontroller |
| Processor Core | — | CPU32 |
| Operating Frequency | — | 16 MHz |
| Program Memory | — | ROMless |
| Internal RAM | — | 2 KB |
| Architecture | — | MC683xx ColdFire family |
| Peripheral Modules | — | TPU and QSM |
| System Module | — | SIM |
| Package Code | — | BQFP |
| Package Body Size | — | 24.13 mm x 24.13 mm |
| Terminal Form | — | Gull wing |
| Temperature Grade | — | Automotive |
| Core Count | — | 1 |
| Eingangsspannungsbereich | — | [DATA_NEEDED: input voltage range] |
| Betriebstemperaturbereich | — | [DATA_NEEDED: operating temperature range] |
| External Memory Interfaces | — | [DATA_NEEDED: external memory interfaces] |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Status | — | [DATA_NEEDED: AEC-Q100 qualification status] |