MC68LK332ACAG16 vs MC68332AMEH16 Comparaison
Comparaison détaillée côte à côte de MC68LK332ACAG16 par NXP Semiconductors et MC68332AMEH16 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MC68LK332ACAG16 - 32-Bit CPU32 MCU 16.78MHz | NXP | Industrial Control
MC68LK332ACAG16 ✗ Fin de vieNXP Semiconductors
MC68332AMEH16 - 16MHz 32-Bit ROMless MCU | NXP | Industrial
MC68332AMEH16 ✗ Fin de vieComparaison des spécifications
| Paramètre | MC68LK332ACAG16 | MC68332AMEH16 |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Fin de vie | Fin de vie |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $19,75 | $15,45 |
| Core Processor | CPU32 (M683xx) | — |
| Core Size | 32-Bit | — |
| Max Clock Frequency | 16.78 MHz | — |
| Program Memory Type | ROMless (external memory) | — |
| RAM Size | 2 KB | — |
| Peripherals | TPU, QSM (QSPI + SCI), SIM | — |
| Tension d'alimentation | 5 V | — |
| Température de fonctionnement | [DATA_NEEDED: Operating Temperature] | — |
| Boîtier | 144-LQFP (20x20 mm) | 132-pin PQFP |
| Type de montage | Surface Mount | Surface mount |
| Connectivity | QSPI, SCI (UART) | — |
| Bus Architecture | Intermodule Bus (IMB) | Intermodule bus |
| External Bus Interface | External data/address bus for ROMless operation | — |
| Qualification | AEC-Q100 (per distributor listing) | — |
| Statut RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Statut du cycle de vie | End of Life (per NXP product page) | — |
| Programmability | Not verified / Programmable (external code) | — |
| Product Type | — | 32-bit microcontroller |
| Processor Core | — | CPU32 |
| Operating Frequency | — | 16 MHz |
| Program Memory | — | ROMless |
| Internal RAM | — | 2 KB |
| Architecture | — | MC683xx ColdFire family |
| Peripheral Modules | — | TPU and QSM |
| System Module | — | SIM |
| Package Code | — | BQFP |
| Package Body Size | — | 24.13 mm x 24.13 mm |
| Terminal Form | — | Gull wing |
| Temperature Grade | — | Automotive |
| Core Count | — | 1 |
| Plage de tension d'entrée | — | [DATA_NEEDED: input voltage range] |
| Plage de température de fonctionnement | — | [DATA_NEEDED: operating temperature range] |
| External Memory Interfaces | — | [DATA_NEEDED: external memory interfaces] |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Status | — | [DATA_NEEDED: AEC-Q100 qualification status] |