MC8641DTHX1333JE vs MC8641DTVU1000GE Vergleich
Detaillierter Direktvergleich von MC8641DTHX1333JE von NXP Semiconductors und MC8641DTVU1000GE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC8641DTHX1333JE - PowerPC e600 Dual-Core 1.333GHz MPU | NXP
MC8641DTHX1333JE ObsoleteNXP Semiconductors
MC8641DTVU1000GE - Dual-Core 1GHz PowerPC SoC | NXP
MC8641DTVU1000GE ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MC8641DTHX1333JE | MC8641DTVU1000GE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $445,00 | $295,00 |
| Core Processor | PowerPC e600 | — |
| Series | MPC86xx | — |
| Number of Cores | 2 | 2 |
| Datenbusbreite | 32-Bit | — |
| Speed | 1.333 GHz | — |
| Core Voltage | 0.95 V | — |
| RAM Controllers | DDR, DDR2 | — |
| Graphics Acceleration | No | — |
| Ethernet | 10/100/1000 Mbps (dual MAC) | — |
| Display & Interface Controllers | Not specified | — |
| Co-Processors / DSP | Not specified | — |
| Gehäuse | 1023-ball FCCBGA (33x33 mm) | 1023-ball FCCBGA (33x33 mm) |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Silicon Revision | G8 REV 3.0 | Rev 3.0 (G8) |
| Betriebstemperatur | -40C to +105C | -40C to +105C |
| Terminal Finish | Tin/Lead (Sn/Pb) | — |
| Peak Reflow Temperature | 245 C (max 30 s) | — |
| Technology | CMOS | — |
| RoHS-Status | RoHS non-compliant (Sn/Pb finish) | Compliant (per distributor listings) |
| Part Status | Obsolete | — |
| Processor Type | — | PowerPC e600 (MPC86xx) Dual-Core SoC |
| Core Architecture | — | Superscalar e600, 32-bit, 3-issue / 7-stage pipeline |
| Core Frequency | — | 1.0 GHz |
| SIMD Engine | — | AltiVec per core |
| Core Supply Voltage | — | 1.05 V (0.95 V variant per part suffix) |
| I/O Supply Voltages | — | 1.8 V / 2.5 V / 3.3 V |
| Memory Controller | — | Integrated DDR1/DDR2 with ECC |
| Integrated MACs | — | Gigabit Ethernet (GbE) |
| PCI Express | — | PCIe interfaces integrated |
| Serial RapidIO (SRIO) | — | Integrated SRIO fabric |
| Process Technology | — | 0.09 um CMOS |