MC8641DVJ1333JE vs MC8641VU1500KE Vergleich
Detaillierter Direktvergleich von MC8641DVJ1333JE von NXP Semiconductors und MC8641VU1500KE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC8641DVJ1333JE - Dual e600 SoC, 2x1333 MHz, Rev 3 | NXP Semiconductors
MC8641DVJ1333JE ⚠ Letzte BestellmöglichkeitNXP Semiconductors
MC8641VU1500KE - PowerPC e600 MPU, 1.5GHz, 994-FCCBGA | NXP
MC8641VU1500KE ObsoleteSpezifikationsvergleich
| Parameter | MC8641DVJ1333JE | MC8641VU1500KE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $660,00 | $195,00 |
| Core Architecture | PowerPC e600 (dual-core) | — |
| Number of Cores | 2 | 1 |
| Core Frequency | 1333 MHz | — |
| Datenbusbreite | 32-bit | 32-bit |
| SIMD Extensions | AltiVec | — |
| Memory Controller | DDR1/DDR2 with ECC | — |
| Ethernet | 2x 10/100/1000 (Gigabit) MACs | 4 x 10/100/1000 Mbps MAC |
| PCI Express | Yes | Dual x4 PCIe endpoints |
| Serial RapidIO (SRIO) | Yes | — |
| Betriebstemperatur | 0°C to +105°C | 0°C to +105°C |
| Gehäuse | 1023-FCCBGA (33x33 mm) | 994-FCCBGA (33x33 mm), ceramic flip-chip |
| Montageart | Surface Mount | — |
| Silicon Revision | Rev 3 | — |
| MSL-Level | [DATA_NEEDED: moisture sensitivity level] | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | RoHS compliant (ceramic BGA) |
| Core Processor | — | PowerPC e600 |
| Maximum Core Frequency | — | 1.5 GHz |
| Supply Voltage (Core) | — | 1.05 V |
| Supply Voltage (I/O) | — | 1.1 V / 1.8 V / 2.5 V / 3.3 V |
| RAM Controllers | — | DDR1, DDR2 (with ECC) |
| Serial RapidIO | — | Yes |
| AltiVec SIMD Engine | — | Yes (128-bit) |
| Cryptographic Acceleration | — | AES, DES/3DES, RSA, ECC |
| Pin-Anzahl | — | 1023 (effective BGA balls) |
| Process Technology | — | 90 nm CMOS |