MC8641DVJ1333JE vs MC8641VU1500KE Comparación
Comparación detallada lado a lado de MC8641DVJ1333JE por NXP Semiconductors y MC8641VU1500KE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC8641DVJ1333JE - Dual e600 SoC, 2x1333 MHz, Rev 3 | NXP Semiconductors
MC8641DVJ1333JE ⚠ Última compraNXP Semiconductors
MC8641VU1500KE - PowerPC e600 MPU, 1.5GHz, 994-FCCBGA | NXP
MC8641VU1500KE ObsoleteComparación de especificaciones
| Parámetro | MC8641DVJ1333JE | MC8641VU1500KE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Última compra | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $660,00 | $195,00 |
| Core Architecture | PowerPC e600 (dual-core) | — |
| Number of Cores | 2 | 1 |
| Core Frequency | 1333 MHz | — |
| Ancho del bus de datos | 32-bit | 32-bit |
| SIMD Extensions | AltiVec | — |
| Memory Controller | DDR1/DDR2 with ECC | — |
| Ethernet | 2x 10/100/1000 (Gigabit) MACs | 4 x 10/100/1000 Mbps MAC |
| PCI Express | Yes | Dual x4 PCIe endpoints |
| Serial RapidIO (SRIO) | Yes | — |
| Temperatura de funcionamiento | 0°C to +105°C | 0°C to +105°C |
| Encapsulado | 1023-FCCBGA (33x33 mm) | 994-FCCBGA (33x33 mm), ceramic flip-chip |
| Tipo de montaje | Surface Mount | — |
| Silicon Revision | Rev 3 | — |
| Nivel MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance status] | RoHS compliant (ceramic BGA) |
| Core Processor | — | PowerPC e600 |
| Maximum Core Frequency | — | 1.5 GHz |
| Supply Voltage (Core) | — | 1.05 V |
| Supply Voltage (I/O) | — | 1.1 V / 1.8 V / 2.5 V / 3.3 V |
| RAM Controllers | — | DDR1, DDR2 (with ECC) |
| Serial RapidIO | — | Yes |
| AltiVec SIMD Engine | — | Yes (128-bit) |
| Cryptographic Acceleration | — | AES, DES/3DES, RSA, ECC |
| Recuento de pines | — | 1023 (effective BGA balls) |
| Process Technology | — | 90 nm CMOS |