MC9RS08KB12CWJ vs MC9RS08KA8CWJ Vergleich
Detaillierter Direktvergleich von MC9RS08KB12CWJ von NXP Semiconductors und MC9RS08KA8CWJ von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9RS08KB12CWJ - 8-bit RS08 MCU, 12KB Flash, 20MHz | NXP SOIC-20
MC9RS08KB12CWJ ✓ AktivNXP Semiconductors
MC9RS08KA8CWJ - 8-bit RS08 MCU, 8KB Flash, 20MHz | NXP
MC9RS08KA8CWJ ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MC9RS08KB12CWJ | MC9RS08KA8CWJ |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $2,32 | $1,68 |
| Core | RS08 (8-bit, HC08-compatible instruction subset) | — |
| Program Memory (Flash) | 12 KB (12K x 8) | — |
| RAM | 126 bytes | — |
| Maximum CPU Frequency | 20 MHz | 20 MHz |
| Operating Voltage Range | 2.5 V / 3.3 V / 5 V | 2.5 V to 5.5 V (also stated as 2.5V/3.3V/5V) |
| ADC | [DATA_NEEDED: ADC channels and resolution] | — |
| Timers | 8-bit timer with PWM channel | — |
| Analog Comparator | Integrated | — |
| Interrupt Architecture | Single global interrupt vector | — |
| Instruction Set Features | HC08 subset + BGND (background debug) | — |
| Gehäuse | 20-SOIC (0.295 inch / 7.50 mm body width) | 20-SOIC Wide (20-SOIC W, Tube) |
| Montageart | Surface Mount | Surface Mount (SMD/SMT) |
| Betriebstemperaturbereich | [DATA_NEEDED: temperature grade from datasheet] | -40 C to +85 C (Industrial) |
| Debug Interface | Background Debug Mode (BDM) | — |
| RoHS-Status | [DATA_NEEDED: RoHS status from official source] | [DATA_NEEDED: RoHS status from data] |
| Lead-Free | [DATA_NEEDED: lead-free reflow compatibility] | — |
| Core Architecture | — | RS08 (8-bit, HC08 subset) |
| Datenbusbreite | — | 8 bit |
| Program Memory Size | — | 8 KB Flash |
| Number of I/O Pins | — | 18 |
| Pin/Package Count | — | 20 pins |
| Instruction Set | — | Subset of HC08 with added BGND instruction |
| Peripherals | — | Keyboard Interface (KBI), Timers, Internal Clock Source |
| Packaging Method | — | Tube |
| MSL-Level | — | [DATA_NEEDED: MSL level] |