MC9RS08KB12CWJ vs MC9RS08KA8CWJ Comparación

Comparación detallada lado a lado de MC9RS08KB12CWJ por NXP Semiconductors y MC9RS08KA8CWJ por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

NXP Semiconductors
MC9RS08KB12CWJ MC9RS08KB12CWJ - 8-bit RS08 MCU, 12KB Flash, 20MHz | NXP SOIC-20

MC9RS08KB12CWJ - 8-bit RS08 MCU, 12KB Flash, 20MHz | NXP SOIC-20

MC9RS08KB12CWJ ✓ Activo
NXP Semiconductors
MC9RS08KA8CWJ MC9RS08KA8CWJ - 8-bit RS08 MCU, 8KB Flash, 20MHz | NXP

MC9RS08KA8CWJ - 8-bit RS08 MCU, 8KB Flash, 20MHz | NXP

MC9RS08KA8CWJ ⚠ Última compra

Comparación de especificaciones

Parámetro MC9RS08KB12CWJ MC9RS08KA8CWJ
Marca NXP Semiconductors NXP Semiconductors
Categoría Microcontrollers Microcontrollers
Estado del ciclo de vida Activo Última compra
Estado del stock In Stock In Stock
Precio unitario (USD) $2,32 $1,68
Core RS08 (8-bit, HC08-compatible instruction subset) —
Program Memory (Flash) 12 KB (12K x 8) —
RAM 126 bytes —
Maximum CPU Frequency 20 MHz 20 MHz
Operating Voltage Range 2.5 V / 3.3 V / 5 V 2.5 V to 5.5 V (also stated as 2.5V/3.3V/5V)
ADC [DATA_NEEDED: ADC channels and resolution] —
Timers 8-bit timer with PWM channel —
Analog Comparator Integrated —
Interrupt Architecture Single global interrupt vector —
Instruction Set Features HC08 subset + BGND (background debug) —
Encapsulado 20-SOIC (0.295 inch / 7.50 mm body width) 20-SOIC Wide (20-SOIC W, Tube)
Tipo de montaje Surface Mount Surface Mount (SMD/SMT)
Rango de temperatura de funcionamiento [DATA_NEEDED: temperature grade from datasheet] -40 C to +85 C (Industrial)
Debug Interface Background Debug Mode (BDM) —
Estado RoHS [DATA_NEEDED: RoHS status from official source] [DATA_NEEDED: RoHS status from data]
Lead-Free [DATA_NEEDED: lead-free reflow compatibility] —
Core Architecture — RS08 (8-bit, HC08 subset)
Ancho del bus de datos — 8 bit
Program Memory Size — 8 KB Flash
Number of I/O Pins — 18
Pin/Package Count — 20 pins
Instruction Set — Subset of HC08 with added BGND instruction
Peripherals — Keyboard Interface (KBI), Timers, Internal Clock Source
Packaging Method — Tube
Nivel MSL — [DATA_NEEDED: MSL level]

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