MC9RS08LA8CLF vs MC9RS08KA8CWJ Vergleich
Detaillierter Direktvergleich von MC9RS08LA8CLF von NXP Semiconductors und MC9RS08KA8CWJ von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9RS08LA8CLF - 8KB Flash 8-Bit RS08 MCU w/ LCD | NXP
MC9RS08LA8CLF ⚠ Letzte BestellmöglichkeitNXP Semiconductors
MC9RS08KA8CWJ - 8-bit RS08 MCU, 8KB Flash, 20MHz | NXP
MC9RS08KA8CWJ ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MC9RS08LA8CLF | MC9RS08KA8CWJ |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $3,16 | $1,68 |
| Core | RS08 (8-bit HC08 subset) | — |
| Program Memory Size | 8 KB (8K x 8) Flash | 8 KB Flash |
| RAM Size | 256 B | — |
| Maximum CPU Frequency | 20 MHz | 20 MHz |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Number of I/O Lines | 31 | — |
| Oscillator Type | Internal | — |
| LCD Driver | Integrated segmented LCD with charge pump | — |
| Gehäuse / Bauform | 48-LQFP (7x7) | — |
| Montageart | Surface Mount | Surface Mount (SMD/SMT) |
| Betriebstemperaturbereich | -40C to +85C | -40 C to +85 C (Industrial) |
| Program Memory Type | Flash | — |
| Connectivity | I2C, SCI/SPI, GPIO | — |
| Peripherals | LCD driver, RTCC, ADC, TIM, KBI, BDM | Keyboard Interface (KBI), Timers, Internal Clock Source |
| Packaging | Tray | — |
| MSL-Level | 3 | [DATA_NEEDED: MSL level] |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS status from data] |
| Series | RS08LA | — |
| Lifecycle | End of Life (Last Time Buy announced by NXP) | — |
| Core Architecture | — | RS08 (8-bit, HC08 subset) |
| Datenbusbreite | — | 8 bit |
| Operating Voltage Range | — | 2.5 V to 5.5 V (also stated as 2.5V/3.3V/5V) |
| Number of I/O Pins | — | 18 |
| Gehäuse | — | 20-SOIC Wide (20-SOIC W, Tube) |
| Pin/Package Count | — | 20 pins |
| Instruction Set | — | Subset of HC08 with added BGND instruction |
| Packaging Method | — | Tube |