MC9RS08LA8CLF vs MC9RS08KA8CWJ Comparaison
Comparaison détaillée côte à côte de MC9RS08LA8CLF par NXP Semiconductors et MC9RS08KA8CWJ par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MC9RS08LA8CLF - 8KB Flash 8-Bit RS08 MCU w/ LCD | NXP
MC9RS08LA8CLF ⚠ Dernier achatNXP Semiconductors
MC9RS08KA8CWJ - 8-bit RS08 MCU, 8KB Flash, 20MHz | NXP
MC9RS08KA8CWJ ⚠ Dernier achatComparaison des spécifications
| Paramètre | MC9RS08LA8CLF | MC9RS08KA8CWJ |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Dernier achat | Dernier achat |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $3,16 | $1,68 |
| Core | RS08 (8-bit HC08 subset) | — |
| Program Memory Size | 8 KB (8K x 8) Flash | 8 KB Flash |
| RAM Size | 256 B | — |
| Maximum CPU Frequency | 20 MHz | 20 MHz |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Number of I/O Lines | 31 | — |
| Oscillator Type | Internal | — |
| LCD Driver | Integrated segmented LCD with charge pump | — |
| Boîtier / Format | 48-LQFP (7x7) | — |
| Type de montage | Surface Mount | Surface Mount (SMD/SMT) |
| Plage de température de fonctionnement | -40C to +85C | -40 C to +85 C (Industrial) |
| Program Memory Type | Flash | — |
| Connectivity | I2C, SCI/SPI, GPIO | — |
| Peripherals | LCD driver, RTCC, ADC, TIM, KBI, BDM | Keyboard Interface (KBI), Timers, Internal Clock Source |
| Packaging | Tray | — |
| Niveau MSL | 3 | [DATA_NEEDED: MSL level] |
| Statut RoHS | Compliant | [DATA_NEEDED: RoHS status from data] |
| Series | RS08LA | — |
| Lifecycle | End of Life (Last Time Buy announced by NXP) | — |
| Core Architecture | — | RS08 (8-bit, HC08 subset) |
| Largeur du bus de données | — | 8 bit |
| Operating Voltage Range | — | 2.5 V to 5.5 V (also stated as 2.5V/3.3V/5V) |
| Number of I/O Pins | — | 18 |
| Boîtier | — | 20-SOIC Wide (20-SOIC W, Tube) |
| Pin/Package Count | — | 20 pins |
| Instruction Set | — | Subset of HC08 with added BGND instruction |
| Packaging Method | — | Tube |