MC9RS08LA8CLF vs MC9RS08KA8CWJ Comparação
Comparação detalhada lado a lado de MC9RS08LA8CLF por NXP Semiconductors e MC9RS08KA8CWJ por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.
NXP Semiconductors
MC9RS08LA8CLF - 8KB Flash 8-Bit RS08 MCU w/ LCD | NXP
MC9RS08LA8CLF ⚠ Última compraNXP Semiconductors
MC9RS08KA8CWJ - 8-bit RS08 MCU, 8KB Flash, 20MHz | NXP
MC9RS08KA8CWJ ⚠ Última compraComparação de especificações
| Parâmetro | MC9RS08LA8CLF | MC9RS08KA8CWJ |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoria | Microcontrollers | Microcontrollers |
| Status do ciclo de vida | Última compra | Última compra |
| Status do estoque | In Stock | In Stock |
| Preço unitário (USD) | $3,16 | $1,68 |
| Core | RS08 (8-bit HC08 subset) | — |
| Program Memory Size | 8 KB (8K x 8) Flash | 8 KB Flash |
| RAM Size | 256 B | — |
| Maximum CPU Frequency | 20 MHz | 20 MHz |
| Supply Voltage Range | 2.7 V to 5.5 V | — |
| Number of I/O Lines | 31 | — |
| Oscillator Type | Internal | — |
| LCD Driver | Integrated segmented LCD with charge pump | — |
| Encapsulamento / Caixa | 48-LQFP (7x7) | — |
| Tipo de montagem | Surface Mount | Surface Mount (SMD/SMT) |
| Faixa de temperatura de operação | -40C to +85C | -40 C to +85 C (Industrial) |
| Program Memory Type | Flash | — |
| Connectivity | I2C, SCI/SPI, GPIO | — |
| Peripherals | LCD driver, RTCC, ADC, TIM, KBI, BDM | Keyboard Interface (KBI), Timers, Internal Clock Source |
| Packaging | Tray | — |
| Nível MSL | 3 | [DATA_NEEDED: MSL level] |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status from data] |
| Series | RS08LA | — |
| Lifecycle | End of Life (Last Time Buy announced by NXP) | — |
| Core Architecture | — | RS08 (8-bit, HC08 subset) |
| Largura do barramento de dados | — | 8 bit |
| Operating Voltage Range | — | 2.5 V to 5.5 V (also stated as 2.5V/3.3V/5V) |
| Number of I/O Pins | — | 18 |
| Encapsulamento | — | 20-SOIC Wide (20-SOIC W, Tube) |
| Pin/Package Count | — | 20 pins |
| Instruction Set | — | Subset of HC08 with added BGND instruction |
| Packaging Method | — | Tube |