MC9S08AC60CFGE vs MC9S08GT60CFD Vergleich

Detaillierter Direktvergleich von MC9S08AC60CFGE von NXP Semiconductors und MC9S08GT60CFD von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S08AC60CFGE MC9S08AC60CFGE - 8-bit S08 MCU, 60KB Flash, 40MHz | NXP

MC9S08AC60CFGE - 8-bit S08 MCU, 60KB Flash, 40MHz | NXP

MC9S08AC60CFGE Nrnd
NXP Semiconductors
MC9S08GT60CFD MC9S08GT60CFD - 8-bit 40MHz S08 MCU 60KB Flash QFN48 | NXP

MC9S08GT60CFD - 8-bit 40MHz S08 MCU 60KB Flash QFN48 | NXP

MC9S08GT60CFD ✓ Aktiv

Spezifikationsvergleich

Parameter MC9S08AC60CFGE MC9S08GT60CFD
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $3,42 $5,10
Core Processor S08 (HCS08), 8-bit CISC —
Core Size 8-bit —
Maximum CPU Frequency 40 MHz 40 MHz
Internal Bus Frequency 20 MHz —
Flash Memory 60 KB (60K x 8) —
RAM 2 KB —
Supply Voltage Range 2.7 V to 5.5 V —
Operating Supply 3.3 V / 5 V —
ADC Resolution 10-bit —
ADC Channels (44-pin package) 8-channel (up to 16-channel family max) —
Communication Interfaces 2x SCI (LIN 2.0, SAE J2602), SPI, IIC —
GPIO (44-pin package) 34 general-purpose I/O —
I/O Ports (family max) 38 —
Gehäuse 44-LQFP (10 x 10 mm) —
Montageart Surface Mount Surface Mount
Packaging Tray —
Betriebstemperatur [DATA_NEEDED: operating temperature range] —
Debug Interface Background Debug Mode (BDM), 6-pin connector —
Series S08AC (Flexis AC family) —
RoHS-Status RoHS compliant [DATA_NEEDED: RoHS compliance status]
Manufacturer — NXP Semiconductors (formerly Freescale)
Part Family — HCS08 S08GT Series
Core Architecture — HCS08 (8-bit CISC)
Program Memory Size — 60 KB (60K x 8) Flash
RAM Size — 4 KB (4K x 8)
Number of I/O Pins — 39
Gehäuse / Bauform — 48-VFQFN Exposed Pad (48-QFN 7x7 mm)
Betriebsversorgungsspannung — 2.5V / 3.3V
Number of Interrupts/Reset Sources — Up to 32
Tray Packaging — Tray (per FindIC listing)
Background Debug Mode — Yes (BGND instruction)
Internal Pullup — Yes (RESET and IRQ pins)

Datenblätter & Ressourcen

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