MC9S08AC8MFGE vs MC9S08GT60ACFBE Vergleich
Detaillierter Direktvergleich von MC9S08AC8MFGE von NXP Semiconductors und MC9S08GT60ACFBE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08AC8MFGE | MC9S08GT60ACFBE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $4,95 | $9,85 |
| Core | HCS08 (S08) 8-bit CPU | — |
| CPU Clock Speed | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | — |
| Program Flash Memory | 8 KB (8K x 8) | — |
| RAM | 512 B | 4 KB |
| Versorgungsspannung | 2.7 V to 5.5 V | 1.8 V to 3.6 V |
| I/O Pins | 38 | 34 |
| Gehäuse | 44-LQFP (10x10 mm) | 44-QFP (10x10 mm) |
| Montageart | Surface Mount (Gull Wing) | Surface Mount |
| Temperature Grade | Automotive | — |
| Package Code | LQFP | — |
| Peripherals | ADC, TPM, SCI, SPI, I2C | — |
| ADC | 10-bit, multi-channel | 8-channel, 10-bit |
| Betriebstemperaturbereich | -40C to +125C | — |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | 3 | — |
| ROM Type | Flash | — |
| Core Architecture | — | HCS08 (enhanced S08) |
| CPU Bit Width | — | 8-bit |
| Maximum CPU Frequency | — | 40 MHz (20 MHz bus) |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| Communication Interfaces | — | 1x SCI, 1x SPI, 1x I2C |
| Timers | — | Multiple TPM channels [DATA_NEEDED: exact channel count] |
| Betriebstemperatur | — | -40 C to +85 C (industrial) |
| Instruction Set | — | CISC, HC08 with BGND |
| Interrupt Sources | — | Up to 32 |
| Pull-ups | — | Software-selectable on ports |