MC9S08AC8MFGE vs MC9S08GT60ACFBE Comparación
Comparación detallada lado a lado de MC9S08AC8MFGE por NXP Semiconductors y MC9S08GT60ACFBE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08AC8MFGE | MC9S08GT60ACFBE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4,95 | $9,85 |
| Core | HCS08 (S08) 8-bit CPU | — |
| CPU Clock Speed | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | — |
| Program Flash Memory | 8 KB (8K x 8) | — |
| RAM | 512 B | 4 KB |
| Tensión de alimentación | 2.7 V to 5.5 V | 1.8 V to 3.6 V |
| I/O Pins | 38 | 34 |
| Encapsulado | 44-LQFP (10x10 mm) | 44-QFP (10x10 mm) |
| Tipo de montaje | Surface Mount (Gull Wing) | Surface Mount |
| Temperature Grade | Automotive | — |
| Package Code | LQFP | — |
| Peripherals | ADC, TPM, SCI, SPI, I2C | — |
| ADC | 10-bit, multi-channel | 8-channel, 10-bit |
| Rango de temperatura de funcionamiento | -40C to +125C | — |
| Estado RoHS | Compliant | Compliant |
| Nivel MSL | 3 | — |
| ROM Type | Flash | — |
| Core Architecture | — | HCS08 (enhanced S08) |
| CPU Bit Width | — | 8-bit |
| Maximum CPU Frequency | — | 40 MHz (20 MHz bus) |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| Communication Interfaces | — | 1x SCI, 1x SPI, 1x I2C |
| Timers | — | Multiple TPM channels [DATA_NEEDED: exact channel count] |
| Temperatura de funcionamiento | — | -40 C to +85 C (industrial) |
| Instruction Set | — | CISC, HC08 with BGND |
| Interrupt Sources | — | Up to 32 |
| Pull-ups | — | Software-selectable on ports |