MC9S08AW16MPUE vs MC9S08AW60MPUE557 Vergleich
Detaillierter Direktvergleich von MC9S08AW16MPUE von NXP Semiconductors und MC9S08AW60MPUE557 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9S08AW16MPUE - 8-bit HCS08 MCU, 16KB Flash, 64-LQFP | NXP
MC9S08AW16MPUE ✓ AktivNXP Semiconductors
MC9S08AW60MPUE557 - 8-bit HCS08 MCU 60KB Flash 40MHz LQFP-64
MC9S08AW60MPUE557 ✓ AktivSpezifikationsvergleich
| Parameter | MC9S08AW16MPUE | MC9S08AW60MPUE557 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $4,35 | $6,10 |
| Core | HCS08 (enhanced S08) | — |
| Datenbusbreite | 8 bit | 8-bit |
| Program Memory Size | 16 KB Flash | — |
| RAM Size | 1 KB | — |
| Maximale Taktfrequenz | 40 MHz | — |
| ADC Resolution | 10 bit | — |
| Number of I/Os | 54 I/O | — |
| Betriebsversorgungsspannung | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +125 C (Automotive Grade 1) | — |
| Montagestil | SMD/SMT | — |
| Gehäuse / Bauform | 64-LQFP (10x10 mm, gull-wing) | — |
| Package Code (per JEDEC) | LFQFP | — |
| Series | MC9S08AW16 (S08AW family) | — |
| Communication Interfaces | SCI, SPI, I2C | — |
| Timers | TPM, MTIM, RTI | — |
| Watchdog | Yes (COP) | — |
| Low Voltage Detect (LVD) | Yes | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | Yes | [DATA_NEEDED: lead-free status] |
| Core Architecture | — | HCS08 (enhanced S08) |
| CPU Clock Speed | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| RAM | — | 4 KB |
| I/O Pins | — | 38 (per digchip datasheet); 64 programmable I/O lines per microchipusa |
| Gehäuse | — | 64-LQFP (10x10 mm) |
| Montageart | — | Surface Mount |
| Betriebstemperatur | — | [DATA_NEEDED: operating temperature range] |
| ADC | — | [DATA_NEEDED: number of channels and resolution] |
| PWM Channels | — | [DATA_NEEDED: PWM channel count] |
| Serial Interfaces | — | SCI, SPI, I2C (per NXP family description) |
| Debug Interface | — | Single-wire Background Debug Mode (BDM) |