MC9S08AW16MPUE vs MC9S08AW60MPUE557 Comparación
Comparación detallada lado a lado de MC9S08AW16MPUE por NXP Semiconductors y MC9S08AW60MPUE557 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S08AW16MPUE - 8-bit HCS08 MCU, 16KB Flash, 64-LQFP | NXP
MC9S08AW16MPUE ✓ ActivoNXP Semiconductors
MC9S08AW60MPUE557 - 8-bit HCS08 MCU 60KB Flash 40MHz LQFP-64
MC9S08AW60MPUE557 ✓ ActivoComparación de especificaciones
| Parámetro | MC9S08AW16MPUE | MC9S08AW60MPUE557 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $4,35 | $6,10 |
| Core | HCS08 (enhanced S08) | — |
| Ancho del bus de datos | 8 bit | 8-bit |
| Program Memory Size | 16 KB Flash | — |
| RAM Size | 1 KB | — |
| Frecuencia de reloj máxima | 40 MHz | — |
| ADC Resolution | 10 bit | — |
| Number of I/Os | 54 I/O | — |
| Tensión de alimentación de funcionamiento | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +125 C (Automotive Grade 1) | — |
| Estilo de montaje | SMD/SMT | — |
| Encapsulado / Carcasa | 64-LQFP (10x10 mm, gull-wing) | — |
| Package Code (per JEDEC) | LFQFP | — |
| Series | MC9S08AW16 (S08AW family) | — |
| Communication Interfaces | SCI, SPI, I2C | — |
| Timers | TPM, MTIM, RTI | — |
| Watchdog | Yes (COP) | — |
| Low Voltage Detect (LVD) | Yes | — |
| Estado RoHS | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | Yes | [DATA_NEEDED: lead-free status] |
| Core Architecture | — | HCS08 (enhanced S08) |
| CPU Clock Speed | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| RAM | — | 4 KB |
| I/O Pins | — | 38 (per digchip datasheet); 64 programmable I/O lines per microchipusa |
| Encapsulado | — | 64-LQFP (10x10 mm) |
| Tipo de montaje | — | Surface Mount |
| Temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| ADC | — | [DATA_NEEDED: number of channels and resolution] |
| PWM Channels | — | [DATA_NEEDED: PWM channel count] |
| Serial Interfaces | — | SCI, SPI, I2C (per NXP family description) |
| Debug Interface | — | Single-wire Background Debug Mode (BDM) |