MC9S08AW32CPUE vs MC9S08AW60CPUE Vergleich
Detaillierter Direktvergleich von MC9S08AW32CPUE von NXP Semiconductors und MC9S08AW60CPUE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MC9S08AW32CPUE | MC9S08AW60CPUE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $6,10 | $0,00 |
| Core Processor | S08 | S08 (HCS08) |
| Core Size | 8-Bit | 8-Bit |
| Max Clock Speed | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | 20 MHz |
| Flash Memory | 32KB (32K x 8) | 60 KB (60K x 8) |
| RAM | 2KB | — |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| I/O Count | 38 | 38 |
| ADC Resolution | 10-bit | — |
| Instruction Set | HC08 with added BGND instruction | HC08 (CISC) with added BGND instruction |
| Debug Interface | Single-wire background debug mode (BDM) | Single-wire background debug mode (BDM) |
| Gehäuse | 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220) | 64-LQFP (10 x 10 mm, 0.5 mm pitch, MO-220VKKD-2, 1 mm height) |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | -40C to +85C | [DATA_NEEDED: Operating Temperature Range] |
| Packaging | Tray | — |
| Lebenszyklusstatus | NRND (Not Recommended for New Designs) | — |
| Family | S08AW (AW60/48/32/16) | HCS08 (S08AW) |
| Speed (CPU Clock) | — | 40 MHz |
| RAM Size | — | 4 KB |
| Peripherals | — | 16-bit timer, ADC, SCI, SPI, multiple power-saving modes |
| ADC | — | 10-bit |
| Life Cycle Stage | — | Active |
| Programmable Memory Type | — | Flash |