MC9S08AW32CPUE vs MC9S08AW60CPUE Comparación
Comparación detallada lado a lado de MC9S08AW32CPUE por NXP Semiconductors y MC9S08AW60CPUE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08AW32CPUE | MC9S08AW60CPUE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $6,10 | $0,00 |
| Core Processor | S08 | S08 (HCS08) |
| Core Size | 8-Bit | 8-Bit |
| Max Clock Speed | 40 MHz | — |
| Internal Bus Frequency | 20 MHz | 20 MHz |
| Flash Memory | 32KB (32K x 8) | 60 KB (60K x 8) |
| RAM | 2KB | — |
| Supply Voltage Range | 2.7 V to 5.5 V | 2.7 V to 5.5 V |
| I/O Count | 38 | 38 |
| ADC Resolution | 10-bit | — |
| Instruction Set | HC08 with added BGND instruction | HC08 (CISC) with added BGND instruction |
| Debug Interface | Single-wire background debug mode (BDM) | Single-wire background debug mode (BDM) |
| Encapsulado | 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220) | 64-LQFP (10 x 10 mm, 0.5 mm pitch, MO-220VKKD-2, 1 mm height) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | -40C to +85C | [DATA_NEEDED: Operating Temperature Range] |
| Packaging | Tray | — |
| Estado del ciclo de vida | NRND (Not Recommended for New Designs) | — |
| Family | S08AW (AW60/48/32/16) | HCS08 (S08AW) |
| Speed (CPU Clock) | — | 40 MHz |
| RAM Size | — | 4 KB |
| Peripherals | — | 16-bit timer, ADC, SCI, SPI, multiple power-saving modes |
| ADC | — | 10-bit |
| Life Cycle Stage | — | Active |
| Programmable Memory Type | — | Flash |