MC9S08AW50CFUE vs MC9S08AW48CPUE Vergleich

Detaillierter Direktvergleich von MC9S08AW50CFUE von NXP Semiconductors und MC9S08AW48CPUE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MC9S08AW50CFUE MC9S08AW50CFUE - 8-bit HCS08 MCU 40MHz 50KB Flash | NXP

MC9S08AW50CFUE - 8-bit HCS08 MCU 40MHz 50KB Flash | NXP

MC9S08AW50CFUE ✓ Aktiv
NXP Semiconductors
MC9S08AW48CPUE MC9S08AW48CPUE - 8-bit S08 MCU 48KB Flash 40MHz | NXP

MC9S08AW48CPUE - 8-bit S08 MCU 48KB Flash 40MHz | NXP

MC9S08AW48CPUE Nrnd

Spezifikationsvergleich

Parameter MC9S08AW50CFUE MC9S08AW48CPUE
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $0,00
Core Processor HCS08 (S08) S08 (HCS08) 8-bit CISC
Core Size 8-Bit 8-bit
Maximum Clock Speed 40 MHz —
Flash Memory 50 KB (50K x 8) —
Gehäuse 64-QFP (14x14 mm) —
Montageart Surface Mount Surface Mount
Connectivity I2C, SCI, SPI, UART/USART —
Peripherals LVD, POR —
Product Family S08AW (AW60/48/32/16 general-purpose family) —
Applications Industrial and Automotive —
RAM [DATA_NEEDED: SRAM size] —
Betriebstemperatur [DATA_NEEDED: operating temperature range] [DATA_NEEDED: operating temperature range]
Supply Voltage Range [DATA_NEEDED: supply voltage range] 2.7 V to 5.5 V
EEPROM [DATA_NEEDED: EEPROM size] —
Number of I/O [DATA_NEEDED: GPIO count] —
ADC Resolution [DATA_NEEDED: ADC resolution and channels] —
RoHS-Status [DATA_NEEDED: RoHS compliance] [DATA_NEEDED: RoHS status]
CPU Speed — 40 MHz
Internal Bus Frequency — 20 MHz
Program Memory Type — FLASH
Program Memory Size — 48 KB (48K x 8)
RAM Size — [DATA_NEEDED: RAM size]
EEPROM Size — [DATA_NEEDED: EEPROM size]
I/O Count — 38
Package Type — 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220VKKD-2)
Package Height — 1 mm
Debug Interface — Single-wire background debug mode (BDM)
Instruction Set — HC08 with added BGND instruction
Packaging — Tray
Lebenszyklusstatus — NRND (Not Recommended for New Designs)

Datenblätter & Ressourcen

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