MC9S08AW50CFUE vs MC9S08AW48CPUE Comparación
Comparación detallada lado a lado de MC9S08AW50CFUE por NXP Semiconductors y MC9S08AW48CPUE por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08AW50CFUE | MC9S08AW48CPUE |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $0,00 |
| Core Processor | HCS08 (S08) | S08 (HCS08) 8-bit CISC |
| Core Size | 8-Bit | 8-bit |
| Maximum Clock Speed | 40 MHz | — |
| Flash Memory | 50 KB (50K x 8) | — |
| Encapsulado | 64-QFP (14x14 mm) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Connectivity | I2C, SCI, SPI, UART/USART | — |
| Peripherals | LVD, POR | — |
| Product Family | S08AW (AW60/48/32/16 general-purpose family) | — |
| Applications | Industrial and Automotive | — |
| RAM | [DATA_NEEDED: SRAM size] | — |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Supply Voltage Range | [DATA_NEEDED: supply voltage range] | 2.7 V to 5.5 V |
| EEPROM | [DATA_NEEDED: EEPROM size] | — |
| Number of I/O | [DATA_NEEDED: GPIO count] | — |
| ADC Resolution | [DATA_NEEDED: ADC resolution and channels] | — |
| Estado RoHS | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status] |
| CPU Speed | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Program Memory Type | — | FLASH |
| Program Memory Size | — | 48 KB (48K x 8) |
| RAM Size | — | [DATA_NEEDED: RAM size] |
| EEPROM Size | — | [DATA_NEEDED: EEPROM size] |
| I/O Count | — | 38 |
| Package Type | — | 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220VKKD-2) |
| Package Height | — | 1 mm |
| Debug Interface | — | Single-wire background debug mode (BDM) |
| Instruction Set | — | HC08 with added BGND instruction |
| Packaging | — | Tray |
| Estado del ciclo de vida | — | NRND (Not Recommended for New Designs) |