MC9S08AW50CFUE vs MC9S08AW48CPUE Comparaison
Comparaison détaillée côte à côte de MC9S08AW50CFUE par NXP Semiconductors et MC9S08AW48CPUE par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MC9S08AW50CFUE | MC9S08AW48CPUE |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $0,00 |
| Core Processor | HCS08 (S08) | S08 (HCS08) 8-bit CISC |
| Core Size | 8-Bit | 8-bit |
| Maximum Clock Speed | 40 MHz | — |
| Flash Memory | 50 KB (50K x 8) | — |
| Boîtier | 64-QFP (14x14 mm) | — |
| Type de montage | Surface Mount | Surface Mount |
| Connectivity | I2C, SCI, SPI, UART/USART | — |
| Peripherals | LVD, POR | — |
| Product Family | S08AW (AW60/48/32/16 general-purpose family) | — |
| Applications | Industrial and Automotive | — |
| RAM | [DATA_NEEDED: SRAM size] | — |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Supply Voltage Range | [DATA_NEEDED: supply voltage range] | 2.7 V to 5.5 V |
| EEPROM | [DATA_NEEDED: EEPROM size] | — |
| Number of I/O | [DATA_NEEDED: GPIO count] | — |
| ADC Resolution | [DATA_NEEDED: ADC resolution and channels] | — |
| Statut RoHS | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status] |
| CPU Speed | — | 40 MHz |
| Internal Bus Frequency | — | 20 MHz |
| Program Memory Type | — | FLASH |
| Program Memory Size | — | 48 KB (48K x 8) |
| RAM Size | — | [DATA_NEEDED: RAM size] |
| EEPROM Size | — | [DATA_NEEDED: EEPROM size] |
| I/O Count | — | 38 |
| Package Type | — | 64-LQFP (10x10 mm, 0.5 mm pitch, MO-220VKKD-2) |
| Package Height | — | 1 mm |
| Debug Interface | — | Single-wire background debug mode (BDM) |
| Instruction Set | — | HC08 with added BGND instruction |
| Packaging | — | Tray |
| Statut du cycle de vie | — | NRND (Not Recommended for New Designs) |